Semiconductor Test Panel Connector Alignment
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Solution Overview
Problem
The existing methods for testing electronic devices in semiconductor manufacturing equipment are time-consuming and prone to incorrect connector couplings due to manual alignment and identification of testing-device connectors with test-object connectors.
Innovation Solution
A testing method utilizing a first test panel with plural first test-object connectors and a second test panel with extensible and retractable second test-object connectors, where the second test-object connectors with spring probes are positioned to match the first test-object connectors, allowing for quick and accurate electrical coupling, and panel fixing mechanisms secure the panels together.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual alignment and identification of connectors is used, then connector coupling can be performed, but testing time becomes excessively long
Solution Approach 1:
The patent applies preliminary action by pre-arranging the connector layouts on both the test object panel and testing device panel before the actual testing process. Connectors are positioned in predetermined locations that correspond to each other, eliminating the need for manual alignment during testing. The panels are designed with fixed connector positions that automatically match when the panels are brought together, thus preparing the coupling configuration in advance to save time during actual operation.
2Reliability
If manual alignment of connectors is performed, then connector coupling can be achieved, but connection accuracy decreases due to human error
Solution Approach 1:
The patent applies asymmetry by designing connectors with non-uniform, asymmetric features that provide unique identification characteristics. Each connector has a specific asymmetric shape, position, or configuration that corresponds only to its matching partner, making it impossible to make incorrect connections. This asymmetric design ensures that connectors can only be coupled in the correct orientation and position, eliminating human error in connector matching while maintaining ease of operation.
3Productivity
If multiple connectors are coupled manually one by one, then all connections can be established, but the process becomes extremely time-consuming
Solution Approach 1:
The patent applies merging by combining multiple connector coupling operations into a single integrated action. The test object panel and testing device panel are designed so that when the panels are brought together, all corresponding connectors are coupled simultaneously in one motion rather than individually. This merging of multiple discrete coupling actions into a single unified operation dramatically reduces the time required for connector coupling and increases testing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the time required for testing electronic devices by enabling rapid and correct coupling of connectors, preventing wrong connections and streamlining the functional test process.
Implementation Method 1
the spring probes included in the second test-object connectors are electrically coupled to the first terminals included in the first test-object connectors
Data Source
AI summary
The time required to test an electronic device mounted in semiconductor manufacturing equipment can be reduced. A first test panel mounted, on a first connector surface thereof, with plural first test-object connectors respectively including plural first terminals electrically coupled to an electronic device and a second test panel mounted, on a second connector surface thereof, with plural second test-object connectors respectively including plural spring probes are provided. The first connector surface of the first test panel and the second connector surface of the second test panel are positioned to face each other, the spring probes included in the second test-object connectors are electrically coupled to the first terminals included in the first test-object connectors, and a functional test concerning an electrical characteristic of the electronic device is performed.