Semiconductor Test Peltier Element Thermal Control
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Solution Overview
Problem
Existing semiconductor testing apparatuses face challenges in maintaining the temperature of Peltier elements within a safe range during testing, which can lead to damage and affect the reliability of the tests.
Innovation Solution
The apparatus includes a thermoelectric element module with a control module that adjusts the current flow based on temperature readings from a temperature sensor, ensuring that the Peltier element's temperature remains within a safe range by implementing intermediate rising and falling target temperature values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a larger number of testing apparatuses are installed in the same space to increase test speed, then productivity is improved, but device complexity increases due to space constraints and thermal management challenges
Solution Approach 1:
The patent combines multiple functional components (Peltier element, pusher, cooling module, temperature sensor, and control module) into an integrated testing apparatus that can be compactly arranged. The cooling module is positioned to efficiently cool the Peltier element while the pusher applies force to the semiconductor device, allowing multiple functions to be performed within a reduced spatial footprint, thereby enabling higher density installation of testing apparatuses
Solution Approach 2:
The patent employs a nested arrangement where the temperature sensor is disposed within or on the pusher, and the cooling module is positioned to directly cool the Peltier element. This nested configuration minimizes the overall apparatus size by placing components within the spatial envelope of other components, allowing for more compact installation and higher productivity
2Temperature
If current is supplied to the Peltier element during test process, then heating or cooling function is achieved, but temperature of Peltier element increases too high and may be damaged
Solution Approach 1:
The patent implements a feedback control mechanism where the control module continuously monitors the temperature of the Peltier element through the temperature sensor and adjusts the current supplied to the Peltier element accordingly. When the temperature approaches the maximum allowable temperature, the control module reduces or stops current supply to prevent overheating and damage, thereby maintaining reliability while achieving the required temperature control range
Solution Approach 2:
The patent incorporates a cooling module that is positioned to cool the Peltier element before excessive temperature buildup occurs. The control module can activate the cooling function in advance or concurrently with heating operations to prevent the Peltier element temperature from exceeding safe limits, ensuring durability while maintaining effective temperature control capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents the Peltier element's temperature from exceeding safe limits, enhancing the stability and reliability of semiconductor device testing while also allowing for a more compact apparatus design.
Implementation Method 1
A representative example of the thermoelectric element used in the apparatus for testing semiconductor device is a Peltier element. When a current is supplied to the Peltier element, heat is absorbed by one side of the Peltier element and heat is emitted from the other side thereof.
Data Source
AI summary
An apparatus for testing semiconductor device according to one embodiment comprises: a thermoelement module having both-side surfaces converted into heating surfaces or cooling surfaces according to the direction of a current; a cooling module, which is arranged on the thermoelement module and cools a thermoelement; a pusher module which is arranged under the thermoelement module, and which comes in contact with a device to be tested, mounted in a holder, so as to heat or cool the device to be tested; and a control module for controlling the direction of a current supplied to the thermoelement module according to a target temperature value.