Semiconductor Test Pressurizing Device for Uniform Pressure
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Solution Overview
Problem
Existing semiconductor test devices face challenges in achieving stable electrical contact and precise temperature control for semiconductor chips, particularly due to variations in chip thickness and the need for uniform pressure and efficient heat transfer.
Innovation Solution
A pressurizing device is designed to apply uniform pressure to semiconductor chips through a mechanism involving tension blocks, pusher blocks, springs, and a press shaft, while also enabling direct heat transfer through a temperature supply duct and blower system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure is applied to semiconductor chips during testing, then electrical contact stability is improved, but uniform pressure distribution becomes difficult to achieve due to chip thickness variations
Solution Approach 1:
The patent employs multiple springs with adjustable preloads to change the pressure distribution parameters. By independently adjusting the preload of each spring, the system compensates for chip thickness variations and achieves uniform pressure distribution across the chip surface, resolving the contradiction between contact stability and pressure uniformity.
Solution Approach 2:
The pressing mechanism is divided into multiple independent springs instead of a single pressing element. Each spring can be independently adjusted to apply pressure to different regions of the chip, enabling precise control over pressure distribution and ensuring uniform contact across the entire chip surface.
2Measurement precision
If direct heat transfer is implemented to semiconductor chips, then temperature control accuracy is improved, but device complexity increases
Solution Approach 1:
The temperature supply duct is integrated within the existing pressurizing device structure, nesting the thermal management function inside the mechanical pressing system. This allows direct heat transfer to the chip through the same pathway used for pressure application, improving temperature control accuracy without proportionally increasing device complexity.
Solution Approach 2:
The pressurizing device is designed to perform multiple functions: applying mechanical pressure for electrical contact and providing thermal management through the integrated temperature supply duct. This multi-functionality reduces the need for separate systems, thereby limiting the increase in device complexity while achieving direct heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy of semiconductor tests by ensuring stable electrical contact and rapid, accurate temperature control, thereby improving test efficiency and reducing testing time.
Implementation Method 1
a first spring connected to each of the first pusher block and the second pusher block; a second spring connected to each of the tension block and the base plate
Data Source
AI summary
A pressurizing device for semiconductor testing includes a tension block, a first pusher block extending through the tension block, a base plate on the first pusher block, a second pusher block on the tension block and extending through the base plate, a first spring connected to each of the first pusher block and the second pusher block, a second spring connected to each of the tension block and the base plate, a press plate on the base plate, and a press shaft coupled to the press plate. The press shaft includes a shaft hole.