Semiconductor Package Test System Parallel Receiving Sections
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Solution Overview
Problem
Current semiconductor package test systems are inefficient in testing large quantities of semiconductor packages quickly, leading to increased test time and reduced yield, and they lack the capability to perform tests across various temperature ranges.
Innovation Solution
A semiconductor package test system comprising a test pack with a chuck and a probe block, where the test pack is loaded with semiconductor packages, inserted into a receiving section, and tested using a semiconductor package testing apparatus that applies power and controls temperature, allowing for simultaneous testing of multiple packages at different temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single receiving section is used for testing semiconductor packages, then the device complexity is low, but the productivity is reduced due to inability to test multiple packages simultaneously
Solution Approach 1:
The testing system is divided into multiple receiving sections (first receiving section, second receiving section, etc.), each capable of independently testing semiconductor packages. This segmentation allows parallel testing operations, significantly improving productivity while maintaining manageable complexity through modular design.
Solution Approach 2:
Multiple receiving sections are combined within a single testing apparatus, sharing common control systems and power supply infrastructure. This merging approach enables simultaneous testing of multiple packages while avoiding the need for completely separate testing systems, thus improving productivity without proportionally increasing device complexity.
2Productivity
If multiple receiving sections are added to test more packages simultaneously, then the productivity increases, but the device complexity increases
Solution Approach 1:
Each receiving section is designed with universal functionality to handle different types of semiconductor packages (e.g., first package, second package with different specifications). The receiving sections share common control logic and testing procedures, allowing the system to test multiple packages simultaneously without requiring separate specialized systems for each package type, thus improving productivity while controlling complexity.
3Reliability
If temperature control capability is added to test at various temperature ranges, then the reliability of testing is improved, but the device complexity increases
Solution Approach 1:
Temperature control is implemented locally at each receiving section rather than as a centralized system. Each receiving section has its own temperature control capability, allowing independent temperature adjustment for different testing conditions. This local quality approach enables reliable temperature-dependent testing while keeping the overall system complexity manageable through distributed control.
4Adaptability or versatility
If the test system is designed to handle various package types, then the adaptability is improved, but the ease of operation deteriorates due to increased complexity
Solution Approach 1:
The receiving sections are designed with universal interfaces and standardized testing procedures that can accommodate different types of semiconductor packages. The control system provides unified operation modes that automatically adapt to the specific package type being tested, maintaining ease of operation while achieving high adaptability through standardized protocols and automated package identification.
Data Source
AI summary
A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.