Semiconductor Test Apparatus Relay Configuration for SiC Testing
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Solution Overview
Problem
Existing semiconductor test apparatuses lack the capability to efficiently perform high-voltage/low-current and low-voltage/high-current tests on power semiconductor devices, particularly those with wide bandgap semiconductors like SiC, while ensuring safety and precise measurement.
Innovation Solution
The semiconductor test apparatus includes a circuit configuration with multiple relays and power supplies to apply specific voltage and current conditions during testing. This setup allows for the performance of high-voltage/low-current and low-voltage/high-current tests on semiconductor switching devices, with safety features to prevent high voltage and current states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional test apparatus is used, then the structure is simple, but it cannot perform both high-voltage/low-current and low-voltage/high-current tests simultaneously
Solution Approach 1:
The test apparatus is designed with multiple power supplies (high-voltage power supply and low-voltage power supply) and relay switches that can be configured through different connection patterns to perform both high-voltage/low-current tests and low-voltage/high-current tests using the same hardware platform, achieving multi-functionality without requiring separate dedicated test systems
Solution Approach 2:
The circuit is divided into separate functional modules including high-voltage power supply unit, low-voltage power supply unit, relay switch network, and measurement units. These segmented modules can be independently controlled and configured through the relay switches to address different test requirements, enabling versatile testing capability
2Adaptability or versatility
If high voltage and high current are applied simultaneously, then the test coverage is comprehensive, but safety hazards increase
Solution Approach 1:
The relay switch network dynamically reconfigures the circuit connections based on the selected test mode. When performing high-voltage tests, the relay configuration ensures low-current paths; when performing high-current tests, the configuration ensures low-voltage conditions. This dynamic switching prevents simultaneous high voltage and high current exposure, eliminating safety hazards while maintaining comprehensive test coverage
Solution Approach 2:
The relay switches act as intermediary control elements that mediate between the power supplies and the device under test. They enforce safe operating conditions by preventing direct connection of high-voltage and high-current sources to the device simultaneously, thus eliminating safety risks while enabling comprehensive test coverage through controlled intermediate states
3Measurement precision
If separate test systems are used for high-voltage and low-voltage tests, then measurement precision is maintained, but device complexity increases
Solution Approach 1:
The apparatus uses a unified measurement system with voltage measurement units and current measurement units that can accurately measure parameters across both high-voltage and low-voltage conditions. The same measurement hardware is used for both test modes through relay switching, maintaining measurement precision while avoiding the complexity of separate dedicated measurement systems
Data Source
AI summary
A semiconductor test apparatus includes first and second node portions for connecting a semiconductor switching device. It features a high-voltage, low-current power supply and a low-voltage, high-current power supply. A first relay, rated for the high voltage, connects the first node to the high-voltage supply. A second relay, rated for the low voltage, connects the first node to the low-voltage supply. A third relay, rated for high voltage, is in parallel with the second relay, while a fourth relay, rated for low voltage, is in parallel with the low-voltage supply.