Semiconductor Thermal Testing Shield and Gas Control

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Solution Overview

Problem

Conventional semiconductor device testing apparatuses face challenges in maintaining specific temperature conditions accurately, leading to decreased testing accuracy due to operator-dependent heating or cooling durations and difficulty in maintaining conditions during testing.

Innovation Solution

An apparatus comprising a tester, an interface board, a shield with a recess, a gas-supplying unit, and a temperature-sensing device, controlled by a controller to ensure the semiconductor device is at a predetermined temperature during testing, using a gas like dry clean air between −50° C. and 120° C., and a thermocouple or thermistor for temperature measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If operator-based heating or cooling duration estimation is used, then the testing process can be initiated, but the testing accuracy decreases due to inability to maintain specific temperature conditions

Engineering Contradiction:

Improvetesting accuracyVSAvoidoperator dependency

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

A temperature sensing device (such as a thermocouple or thermistor) is integrated into the testing apparatus to continuously monitor the temperature of the semiconductor device during testing. This real-time feedback enables the system to detect temperature deviations and trigger corrective actions, replacing operator estimation with automated temperature-based control decisions.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The gas-supplying unit automatically responds to temperature changes by supplying cooling or heating gas when temperature deviations are detected, enabling the system to self-regulate and maintain specific temperature conditions without continuous operator intervention.

Inventive Principle:

Principle #25Self-service

2Temperature

If conventional heating or cooling methods are used, then the semiconductor device can be temperature-adjusted, but the specific temperature conditions cannot be maintained during testing

Engineering Contradiction:

Improvetemperature control precisionVSAvoidtemperature condition maintenance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The temperature sensing device provides continuous monitoring of the semiconductor device temperature, feeding this information back to the control system. When temperature deviations from the specific conditions are detected, the system automatically activates the gas-supplying unit to restore the temperature, ensuring reliable maintenance of required temperature conditions throughout the testing process.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The conventional mechanical heating or cooling methods are replaced with a gas-based thermal control system. The gas-supplying unit delivers controlled amounts of cooling or heating gas directly to the semiconductor device, providing more precise and responsive temperature adjustment compared to traditional mechanical approaches.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If real-time temperature monitoring and adjustment is implemented, then testing accuracy is enhanced, but the device complexity increases

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidapparatus configuration

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

A temperature sensing device serves as an intermediary between the semiconductor device and the control system. This sensor acts as a mediator that converts temperature information into electrical signals that can be processed by the control unit, enabling accurate temperature monitoring without requiring complex direct measurement mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The gas-supplying unit utilizes pneumatic principles to deliver controlled flows of cooling or heating gas to the semiconductor device. This approach provides efficient and responsive temperature adjustment through gas flow control, achieving precise thermal management with relatively simple mechanical components compared to other actuation methods.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures the semiconductor device is tested at a precise temperature, enhancing the accuracy of the testing results by real-time temperature adjustment and monitoring.

Implementation Method 1

supplying a gas from the gas-supplying unit to the chamber

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

a thermocouple or thermistor for temperature measurement

Methodology Applied

Scientific EffectThermocouple: Thermocouple

Data Source

PatentUS11626184B2Apparatus for testing semiconductor device and method of testing thereof

Publication Date: 2023.04.11 NAN YA TECH

AI summary

An apparatus for performing thermal testing of a memory device and a method of thermally testing the memory device. The apparatus includes a tester; an interface board disposed over the tester and configured to receive the semiconductor device and connect the semiconductor device to the tester; a shield disposed over the interface board and including a recess; a gas-supplying unit including a conduit extending through the shield and accessible to the recess; a temperature-sensing device disposed within the recess; and a controller configured to control and communicate with the tester, the gas-supplying unit and the temperature-sensing device.