High-Frequency Semiconductor Test Device Noise Shielding
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Solution Overview
Problem
Conventional high-frequency and high-speed semiconductor test devices are expensive due to the use of costly conductive blocks for noise shielding, have processing difficulties at fine pitches, and suffer from poor impedance characteristics and high material costs.
Innovation Solution
A test device with a probe supporting block comprising a conductive block and insulating blocks, using general pogo pin type probes, and a shield tube to shield noise between signal probes, reducing material costs and improving processing and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive block is used for noise shielding, then noise between adjacent signal probes is blocked, but material cost increases and processing becomes difficult at fine pitches
Solution Approach 1:
The conductive block is divided into multiple separate conductive members, each corresponding to individual signal probes. This segmentation allows each conductive member to be processed and positioned independently, making fine-pitch processing much easier while maintaining effective noise shielding between adjacent probes.
Solution Approach 2:
An insulating block is introduced as an intermediary component to hold and position the conductive members. The insulating block provides a structured framework that facilitates precise positioning of conductive members at fine pitches without direct processing of the conductive materials themselves, thereby easing manufacturing.
2Object-affected harmful factors
If a conductive block is used for noise shielding, then noise between adjacent signal probes is blocked, but material cost increases
Solution Approach 1:
Instead of using one large conductive block, the invention uses multiple smaller conductive members segmented and distributed only where needed between signal probes. This reduces the total quantity of conductive material required while maintaining effective noise shielding at each probe interface.
Solution Approach 2:
Conductive members are placed locally only where noise shielding is needed between adjacent signal probes, rather than using a continuous conductive block throughout. This localized approach reduces material consumption while providing shielding precisely where required.
3Productivity
If signal probes are arranged at fine pitches, then testing capability is improved, but processing becomes difficult
Solution Approach 1:
The insulating block serves as a mediator that provides precise positioning features for conductive members and signal probes. This intermediary structure enables fine-pitch arrangements to be manufactured more easily by separating the positioning function from the conductive shielding function.
Solution Approach 2:
By segmenting the conductive shielding into individual members that can be independently positioned on the insulating block, the system achieves fine-pitch capability without the processing difficulties associated with machining fine-pitch features in a single conductive block.
4Ease of operation
If a processed hole in conductive block is used, then signal probe passage is enabled, but impedance characteristic deteriorates due to rough inner surface
Solution Approach 1:
The insulating block acts as an intermediary that provides precisely machined holes for signal probe passage. Since the insulating material is easier to machine with high precision than conductive blocks, the holes can be produced with smooth inner surfaces that maintain good impedance characteristics.
Solution Approach 2:
The positioning and hole structure is copied from the insulating block template to the conductive members, ensuring that all signal probe passages are precisely aligned and have consistent, high-quality surfaces for maintaining impedance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively shields noise between signal probes with a simple structure, reduces costs, and enhances processing and assembly, while maintaining good impedance characteristics.
Implementation Method 1
a first conductive member 110a extending from a first side surface 120a of the insulating block 120 to a second side surface 120b of the insulating block 120 and shielding noise of an adjacent signal probe
Data Source
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AI summary
Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.