Semiconductor Test Socket With Elastic Ground Pad
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Solution Overview
Problem
Conventional semiconductor chip test sockets require expensive engineering plastics for processing, leading to high production costs and poor frequency characteristics and heat dissipation during RF tests due to small ground contact areas and lack of elasticity in metal ground pins.
Innovation Solution
A socket configuration using a film layer with laser-processed terminal and pad combination holes, incorporating a conductive elastic pad made of metal powders in silicone rubber to enhance ground contact area and stability, reducing production expenses and improving RF test performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a metal block ground pin is used, then the structure is simple, but the contact performance and contact stability are low due to lack of elasticity
Solution Approach 1:
The ground pin is constructed as a composite structure combining a metal block base with an elastic material layer (such as phosphor bronze or beryllium copper) on its contact surface. This composite design provides both the structural simplicity and mechanical strength of the metal block and the elasticity and contact performance of the elastic material, thereby improving contact stability while maintaining ease of manufacture.
2Area of stationary object
If a small ground contact area is used, then the device size is small, but the frequency characteristic deteriorates and heat generation increases during RF tests
Solution Approach 1:
The ground pin structure transitions from a two-dimensional flat contact surface to a three-dimensional elevated platform structure. By raising the ground contact surface above the chip surface level, the design increases the effective ground contact area without increasing the lateral footprint of the device, thereby improving frequency characteristics and heat dissipation while maintaining compact device dimensions.
3Ease of manufacture
If engineering plastic material is used for processing, then the socket structure can be formed, but production expenses are high due to the need for expensive materials and complex processing
Solution Approach 1:
The invention extracts and separates the ground pin as an independent component from the socket body, allowing it to be manufactured separately using cost-effective materials and processes. The ground pin can be produced through simpler metalworking or casting processes rather than requiring expensive engineering plastic machining, thereby reducing production expenses while maintaining functional integration when assembled into the socket.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces production costs and enhances frequency characteristics and heat dissipation during RF tests by providing a sufficient ground contact area, improving test stability and efficiency.
Implementation Method 1
a terminal hole for disposing a semiconductor chip test terminal and a pad combination hole for disposing the conductive elastic pad are formed in a film layer using a laser process
Data Source
AI summary
Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.