Semiconductor Test Socket with Elastic Conductive Pillars for Signal Integrity
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Solution Overview
Problem
Existing test sockets for semiconductor packages face issues such as damage to solder balls, high resistance, and signal integrity problems, particularly in high-frequency tests, while conventional Pogo and rubber type sockets have limitations in conductivity and current capacity.
Innovation Solution
A test socket design featuring a first connection structure with conductive plugs and a second connection structure with elastic conductive pillars formed by conductive particles, providing improved conductivity and wider contact area, along with contact pads to protect the elastic conductive pillars and enhance high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Pogo or rubber type sockets are used, then the structure is simple and easy to manufacture, but the conductivity is insufficient and current capacity is limited
Solution Approach 1:
The patent uses composite materials by combining conductive particles (such as metal powder) with elastic material to form elastic conductive pillars. This composite structure provides both the elasticity needed for contact pressure and the conductivity required for high current capacity, resolving the contradiction between simple structure and high reliability.
Solution Approach 2:
The patent changes the physical parameters of the contact structure by using elastic material with specific elasticity and conductive particles with appropriate conductivity. The elastic conductive pillars can be compressed to establish electrical contact, providing both mechanical compliance and electrical conductivity, thus improving reliability without excessive complexity.
2Reliability
If conventional test sockets are used, then the contact area is limited, but damage to solder balls and terminals occurs
Solution Approach 1:
The patent employs elastic conductive pillars made from elastic material that can deform flexibly upon contact. This flexibility allows the pillars to conform to the solder balls and distribute contact pressure over a larger area, reducing localized stress and preventing damage to the semiconductor package terminals while maintaining reliable electrical contact.
3Reliability
If conventional sockets are used, then manufacturing is simple, but high-frequency performance and signal integrity are poor
Solution Approach 1:
The patent extracts the essential function of electrical contact from rigid structures and implements it through elastic conductive pillars that can be integrated into the socket body. This approach simplifies the overall connection structure by eliminating the need for separate rigid contacts while improving high-frequency performance through the elastic material's ability to maintain consistent contact pressure and reduce signal reflection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design offers reliable electrical connections with reduced damage to semiconductor package terminals, enhanced high-frequency performance, and increased current capacity, addressing the limitations of conventional sockets.
Implementation Method 1
the conductive particles in each of the plurality of elastic conductive pillars can produce electrical conductivity in response to an external pressure applied onto the elastic conductive pillar
Implementation Method 2
a second insulating body and a plurality of elastic conductive pillars, the second insulating body being elastic
Data Source
AI summary
A test socket and a test apparatus for testing a semiconductor package are provided. The test socket includes: a first connection structure including a first insulating body and a plurality of conductive plugs within the first insulating body; and a second connection structure disposed on the first connection structure and including a second insulating body and a plurality of elastic conductive pillars, the second insulating body being elastic, and the plurality of elastic conductive pillars being formed by arranging a plurality of conductive particles in the second insulating body in a vertical direction; wherein the plurality of elastic conductive pillars are in vertical alignment with the plurality of plugs of the first connection structure, respectively, and the conductive particles in each of the plurality of elastic conductive pillars can produce electrical conductivity in response to an external pressure applied onto the elastic conductive pillar.