Semiconductor Test Socket Heat Exchanger for Temperature Uniformity
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Solution Overview
Problem
Conventional automatic test equipment (ATE) for semiconductor packages faces challenges in maintaining uniform test temperatures due to temperature gradients between the ambient environment and the surface of the packages under test, leading to reduced reliability of electric operation tests.
Innovation Solution
A test apparatus with a heat exchanger buried on the upper portion of the base board, which contacts the socket board securing the semiconductor package, and a test chamber with temperature control fluid to uniformly set both the upper and lower portions of the package to the test temperature, ensuring accurate and reliable operation tests.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the test chamber is set to a uniform test temperature, then the test space temperature is controlled uniformly, but the PUT experiences temperature gradient between upper and lower portions
Solution Approach 1:
The temperature control system is segmented into two independent zones: the test chamber for upper portion control and the heat exchanger for lower portion control. This allows separate temperature management of different PUT regions, eliminating the temperature gradient that compromises test reliability while maintaining uniform test space temperature.
Solution Approach 2:
The heat exchanger acts as an intermediary component between the ambient environment and the lower portion of the PUT. It mediates temperature control by directly contacting the socket board and transferring thermal energy to the PUT's lower portion, compensating for the temperature gradient without affecting the uniform test space temperature.
2Ease of operation
If active devices are arranged at the bottom of the socket board to operate the PUTs, then the PUTs can be operated, but the operation heats significantly increase the temperature gradient in cold tests
Solution Approach 1:
The heat exchanger is designed to absorb and dissipate the operation heats generated by active devices during cold tests. By converting the harmful thermal effect (temperature gradient increase) into a controllable parameter, the system maintains uniform temperature distribution even when active devices are operating, thus preserving both operation capability and temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that semiconductor packages are tested under uniform temperatures, enhancing the accuracy and reliability of both hot and cold operation tests by effectively dissipating operation heats from active devices and packages, thereby maintaining precise temperature control.
Implementation Method 1
a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board
Implementation Method 2
the test space of the test chamber is set to a test temperature
Data Source
AI summary
A test apparatus and an automatic test equipment having the same are disclosed. The test apparatus includes a test head having a test area, a socket board combined to the test area of the test, the socket board including a socket body and an active device attached on a first surface of the socket body, the active device configured to operate a semiconductor package, and a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board.