Semiconductor Test Socket Plunger Alignment Mechanism
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Solution Overview
Problem
Existing sockets for testing semiconductor chips face reliability issues due to misalignment of electrodes caused by thermal expansion in anisotropic conductive sheets, leading to unstable electric contact and reduced test reliability, and foreign substances causing increased contact resistance.
Innovation Solution
A socket design featuring plungers on both upper and lower portions of conductive sheets, with positioning means to ensure stable alignment and prevent foreign substances from interfering, enhancing the reliability of semiconductor chip testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an anisotropic conductive sheet with positioning holes is used in heating tests, then electrode positioning is improved, but thermal expansion of the resin film causes misalignment and unstable electric contact
Solution Approach 1:
The conductive sheet is divided into multiple independent conductive particles dispersed in an insulating matrix, rather than a continuous conductive layer. This segmentation allows each particle to independently establish contact points, maintaining positioning accuracy despite thermal expansion of the resin film, as the particles can adjust their positions within the expanded matrix without causing systematic misalignment
Solution Approach 2:
The invention changes the physical state and distribution parameters of the conductive material from a continuous film with holes to discrete conductive particles suspended in an insulating matrix. This parameter change enables the system to accommodate thermal expansion while maintaining stable electric contact, as the particles can move and reposition within the expanded volume without losing contact integrity
2Productivity
If repeated tests are performed on conductive parts, then testing productivity is improved, but the upper and lower surfaces of conductive parts become damaged reducing test reliability
Solution Approach 1:
The conductive parts are designed as replaceable components that can be easily更换ed after a certain number of uses. The conductive sheet with its dispersed particle structure allows for cost-effective replacement when surface damage occurs during repeated testing, enabling high productivity through rapid replacement without compromising reliability by using damaged components
Solution Approach 2:
The invention enables easy discarding of worn conductive parts and recovery/replacement with new ones. The modular design allows the conductive sheet to be quickly replaced when surface damage accumulates from repeated testing, maintaining reliability while preserving productivity through efficient component turnover
3Reliability
If plungers are added to both upper and lower portions of conductive parts, then alignment stability and foreign substance prevention are improved, but device complexity increases
Solution Approach 1:
The upper and lower plungers are integrated into a single unified socket structure, combining multiple functions (alignment, contact pressure application, foreign substance prevention) into one cohesive component. This merging reduces the number of separate parts and assembly steps, thereby reducing device complexity while achieving the desired reliability improvements in alignment stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The socket provides stable and reliable electrical connections by maintaining plunger alignment and preventing foreign substances, thereby improving the consistency and accuracy of semiconductor chip testing.
Implementation Method 1
conductive silicone parts which are formed by vertically arranging metal balls (powder) in a main body made of silicone. Test current is applied through the conductive silicone parts to a test circuit board
Implementation Method 2
electrodes of the anisotropic conductive sheet may be misaligned with respect to electrodes of an object to be tested because of thermal expansion of the resin film
Data Source
AI summary
A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB. The support plate has holes at positions corresponding to the lower plungers and fastens the lower plungers to the lower ends of the corresponding conductive parts such that lower ends of the lower plungers protrude outside through the holes of the support plate.