Semiconductor Test Socket With Thermal Control and Probe Access

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Solution Overview

Problem

Current semiconductor testing devices lack effective means to ensure proper probe contact and temperature control, which are crucial for accurate electrical characterization and reliability testing of complex memory devices like DRAM.

Innovation Solution

A testing device with a socket made of thermal conductive material, such as copper, and a cover with a circuit board and opening that exposes the device under test, allowing for direct observation and temperature adjustment, combined with a probe apparatus that includes a manipulator for precise contact and a thermal adjuster for temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a traditional testing device without thermal conductive material is used, then the device structure is simpler, but the temperature control capability is insufficient

Engineering Contradiction:

Improvetemperature control capabilityVSAvoiddevice structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The socket material is changed from traditional non-thermal conductive material to copper or other thermal conductive materials, fundamentally changing the thermal parameter of the testing device to enable effective temperature control of the DUT

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The testing device combines copper socket material with the existing socket structure, creating a composite system that integrates both mechanical support and thermal conduction functions into a single component

Inventive Principle:

Principle #40Composite materials

2Difficulty of detecting and measuring

If a cover without opening is used, then the device structure is more complete, but the observation capability is lost

Engineering Contradiction:

Improveobservation capabilityVSAvoiddevice structure

Core Design Contradiction:

Difficulty of detecting and measuringVSDevice complexity

Solution Approach 1:

An opening is extracted from the cover structure, removing a portion of the cover to create a viewing window that allows optical access to the DUT while maintaining the protective enclosure function of the cover

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The cover is segmented into covered regions and an opening region, allowing different portions of the cover to serve different functions - protection and observation simultaneously

Inventive Principle:

Principle #1Segmentation

3Reliability

If probe contact monitoring is not implemented, then the testing process is simpler, but the testing reliability is reduced

Engineering Contradiction:

Improvetesting reliabilityVSAvoidtesting process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A monitoring system is implemented that provides real-time feedback on probe contact status during testing, allowing the system to detect and respond to contact issues immediately rather than discovering them after test failures

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures reliable probe contact and precise temperature adjustment, enabling effective electrical characterization and reliability testing of semiconductor devices, particularly complex memory devices like DRAM.

Implementation Method 1

The socket includes a thermal conductive material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12092655B2Testing devices and method for testing semiconductor devices

Publication Date: 2024.09.17 NAN YA TECH

AI summary

A testing device and a method for testing a semiconductor device are provided. The testing device includes a socket having a cavity for accommodating a device under test (DUT), and a cover disposed on the socket. The socket includes a thermal conductive material. The cover includes a plate, a circuit board attached to the plate, and an opening penetrating the plate and the circuit board, exposing the cavity of the socket.