Semiconductor Package Test Socket With Segmented Connectors
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Solution Overview
Problem
Current semiconductor packages face challenges in ensuring reliable test operations due to inadequate electrical connections and external environmental protection during testing.
Innovation Solution
A semiconductor package design featuring a test socket with a housing, trench, probes, and connectors that electrically connect exposed contact points on the package substrate, including vertical, parallel, and inclined connectors, ensuring secure and reliable testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If contact points are exposed at the side of the package substrate for testing, then test accessibility is improved, but reliability of test operations deteriorates due to inadequate electrical connections and environmental protection
Solution Approach 1:
The connection element is divided into multiple segments: a first connection portion that contacts the first contact point, a second connection portion that contacts the second contact point, and an intermediate portion that provides environmental protection. This segmentation allows each part to perform its specific function optimally while working together to solve the contradiction between accessibility and reliability
Solution Approach 2:
The connection element is formed as a single integrated structure combining conductive portions for electrical connection and an intermediate portion for environmental protection. This composite structure integrates multiple functions (electrical connection and protection) into one element, ensuring reliable test operations while maintaining accessibility
2Reliability
If the connection element integrates both electrical connection and environmental protection functions, then test operation reliability is improved, but device complexity increases
Solution Approach 1:
The connection element merges the functions of electrical connection and environmental protection into a single integrated structure. The first and second connection portions provide electrical connectivity to contact points, while the intermediate portion provides environmental protection, all within one element rather than requiring separate components
Solution Approach 2:
The connection element serves multiple functions simultaneously: it provides electrical connection to both contact points, environmental protection for the intermediate portion, and structural support. This multi-functionality reduces the need for separate components and simplifies the overall test socket design
Data Source
AI summary
Provided are a socket, a semiconductor package, a test device and a method of manufacturing a semiconductor package. A socket to test a semiconductor package comprising a housing, a trench receiving a semiconductor package in the housing, at least one probe connected to the semiconductor package at a bottom of the trench, and at least one connector electrically connecting a plurality of contact points exposed at a side of the semiconductor package when the semiconductor package is inserted into the trench. A semiconductor package with contacts exposed from a side of a package substrate, and a method of manufacturing such a semiconductor package are also disclosed.