Semiconductor Test Socket Vacuum Path Design
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Solution Overview
Problem
Conventional test apparatuses for package-on-package semiconductor packages face challenges such as solder defects, increased manufacturing time and cost, signal delay, and signal distortion due to the need for a second test circuit board, which complicates high-speed testing and increases the risk of defects like cracks in solder ball terminals.
Innovation Solution
A test apparatus that secures a vacuum pressure line without a second test circuit board by using an inelastic insulating sheet with a vacuum space part and deformation-preventing pillars between the upper test socket and package, reducing the signal path length and enabling precise high-speed testing, while also using oxidation-preventing metal plating on terminals to maintain contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a second test circuit board is used to secure vacuum pressure line, then vacuum pressure can be transmitted to vacuum picker, but signal path length increases causing signal delay and distortion
Solution Approach 1:
The patent removes the second test circuit board from the system entirely. Instead, it uses the pusher's chamber as the vacuum pressure transmission space and forms the vacuum pressure line directly through the vacuum picker, eliminating the unnecessary component that caused signal delay and distortion while maintaining vacuum pressure transmission capability.
Solution Approach 2:
The patent merges the vacuum pressure transmission function with the pusher chamber. The chamber that moves the pusher vertically also serves as the vacuum pressure transmission space, eliminating the need for a separate second test circuit board and reducing the signal path length.
2Reliability
If a second test circuit board is used to form vacuum pressure line, then vacuum picker can be connected to vacuum pressure generating device, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and removes the second test circuit board from the system. The vacuum pressure line is reconfigured to connect the vacuum pressure generating device directly to the vacuum picker through the pusher chamber, eliminating the complex multi-board structure and reducing manufacturing complexity.
3Reliability
If a second test circuit board is used, then vacuum pressure line can be secured, but solder defects and cracks in solder ball terminals occur
Solution Approach 1:
The patent removes the second test circuit board that required soldering operations. By eliminating this component, the patent avoids the soldering process entirely, thereby preventing solder defects and cracks in solder ball terminals while maintaining vacuum pressure transmission through the pusher chamber.
4Speed
If second test circuit board is removed to reduce signal path length, then high-speed testing is enabled, but vacuum pressure line may not be secured
Solution Approach 1:
The patent merges the vacuum pressure transmission function with the pusher chamber. The chamber that moves the pusher vertically also serves as the vacuum pressure transmission space, ensuring reliable vacuum pressure transmission to the vacuum picker even without the second test circuit board, thereby enabling high-speed testing.
Solution Approach 2:
The pusher chamber acts as an intermediary space that simultaneously enables both the mechanical movement of the pusher and the transmission of vacuum pressure to the vacuum picker, maintaining reliable vacuum pressure transmission while eliminating the need for the second test circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient and accurate electrical property testing of semiconductor packages at high speeds, significantly reducing test time and cost, while minimizing defects and maintaining reliable contact resistance over repeated tests.
Implementation Method 1
a vacuum picker mounted on a center of the upper test socket to be able to vacuum-adsorb the lower package; having a vacuum space part formed in a lower surface thereof corresponding to the upper test socket
Data Source
AI summary
The present disclosure relates to a test apparatus for a package-on-package type semiconductor package including a lower test socket mounted on a tester, and connected to a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to the upper package; a vacuum picker mounted on the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part.