Semiconductor Tester Daisy-Chain Drive Signal Path

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Solution Overview

Problem

Conventional semiconductor device testers, particularly high-end ATEs, face challenges in testing multiple DUTs simultaneously while ensuring signal integrity due to long distances between the ALPG and DUT boards, leading to increased testing time and costs.

Innovation Solution

A tester configuration with a daisy chain connection for drive signal paths and separate input/output signal paths, utilizing a pattern generator, deskews, drivers, and comparators to apply and compare signals across multiple DUTs, ensuring signal integrity and allowing for simultaneous testing of multiple DUTs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional ATE tester is used to test multiple DUTs simultaneously, then the testing capacity increases, but the signal integrity deteriorates due to long distances between the ALPG and DUT boards

Engineering Contradiction:
Improvetesting capacityVSAvoidsignal integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The drive signal path is segmented into multiple daisy-chain connected stages, where each stage contains a driver and serves a subset of DUTs. This segmentation reduces the distance each drive signal must travel, maintaining signal integrity while enabling simultaneous testing of multiple DUTs through the expanded testing capacity of the segmented architecture.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the distance between the ALPG and DUT board is increased to test more DUTs, then the testing capacity increases, but the signal distortion and reflection increase

Engineering Contradiction:
Improvetesting capacityVSAvoidsignal distortion and reflection
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

Additional driver circuits are introduced as intermediary components between the ALPG and the DUTs. These intermediate drivers receive the drive signal and re-transmit it to subsequent DUTs in the daisy chain, preventing signal degradation and reflection that would occur over long direct connections, thus enabling expanded testing capacity without harmful signal effects.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a dedicated ATE equipment is used to ensure signal integrity, then the signal integrity is maintained, but the manufacturing cost increases

Engineering Contradiction:
Improvesignal integrityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The daisy-chain drive signal path architecture provides a universal testing framework that can accommodate multiple DUTs simultaneously while maintaining signal integrity through the segmented driver stages. This multi-functional approach eliminates the need for separate dedicated ATE equipment for each DUT, reducing manufacturing costs while preserving reliable signal transmission.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7872488B2Tester for testing semiconductor device
Publication Date: 2011.01.18 UNITEST INC
  • US7872488B2 patent drawing
  • US7872488B2 patent drawing
  • US7872488B2 patent drawing

AI summary

A tester for testing a semiconductor device is disclosed. In accordance with the tester of the present invention, the tester is configured to have different drive signal path and input/output signal path wherein the drive signal path has a fly-by structure, i.e. a daisy chain structure and the input/output signal path has a star-stub structure such that more DUTs may be tested simultaneously and an integrity of the signals is secured.