Multi-Beam Semiconductor Testing for 3D Defect Detection
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Solution Overview
Problem
The miniaturization of semiconductor devices has led to a need for effective testing techniques that can detect defects in vertically structured semiconductor devices, which existing methods have not adequately addressed.
Innovation Solution
A test system and method that utilize two beams with different focal lengths to simultaneously scan multiple regions of a semiconductor device, generating 3D images from reflected beams to identify defects, thereby reducing testing time and improving defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple regions are scanned sequentially using a single beam, then the testing can be performed with simple equipment, but the testing time increases significantly
Solution Approach 1:
The patent divides the testing task into multiple parallel operations by splitting a single beam into multiple beams, each focusing on different regions of the semiconductor device. This segmentation allows simultaneous scanning of multiple regions, directly improving testing speed without requiring multiple independent testing systems.
Solution Approach 2:
The patent combines multiple beam paths and detection channels into a unified testing system. By merging the optical paths of multiple beams and their corresponding detectors into a single integrated system, the patent achieves fast parallel testing while avoiding the complexity of multiple separate testing systems.
2Measurement precision
If a single beam is used to scan the semiconductor device, then the equipment structure is simple, but the ability to detect defects in vertically structured devices is insufficient
Solution Approach 1:
The patent transitions from single-point scanning to multi-point parallel scanning by introducing multiple beams with different focal lengths. This dimensional expansion in the optical testing approach enables simultaneous detection across different vertical layers and horizontal regions, significantly improving defect detection capability for vertically structured devices.
Solution Approach 2:
The patent applies different focal lengths to different beams, creating localized optimization for specific regions and depths within the semiconductor device. Each beam is tailored to focus on particular layers or structures, enabling precise defect detection in vertically structured devices without requiring a completely complex multi-system approach.
3Productivity
If multiple beams with different focal lengths are used to simultaneously scan multiple regions, then the testing time is reduced and defect detection is enhanced, but the optical system complexity increases
Solution Approach 1:
The patent designs an optical system where multiple beams and detectors work together as a unified multi-functional system. The same optical platform performs multiple testing functions simultaneously by directing different beams to different regions, achieving high-efficiency parallel testing without requiring separate dedicated systems for each function.
Solution Approach 2:
The patent introduces beam splitting optics and optical path management components as intermediaries that coordinate multiple beams and detectors. These intermediary elements manage the complexity of the multi-beam system by providing structured optical path division and recombination, enabling efficient parallel testing while maintaining system organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and comprehensive defect detection in semiconductor devices by simultaneously scanning multiple regions, reducing testing time and enhancing the ability to identify defective areas within the devices.
Implementation Method 1
provide a first reflected beam and a second reflected beam from the stage region
Implementation Method 2
A first light detector can be configured to detect the first reflected beam among the first and second reflected beams
Data Source
AI summary
A method of testing can include providing a first beam having a first focal length and a second beam having a second focal length that is less than the first focal length to a stage region to provide a first reflected beam and a second reflected beam from the stage region. The first reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. The second reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. A first image can be generated from the first reflected beam and a second image can be generated from the second reflected beam. The first image and the second image can be combined to provide a 3D image.