Automated Semiconductor Module Testing System with Ball Screw Transfer
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Solution Overview
Problem
Manual testing of semiconductor modules is time-consuming and inefficient, particularly when multiple modules need to be tested, as existing systems can only accommodate one module at a time and require manual transfer between testing stages.
Innovation Solution
A semiconductor testing system that includes a first testing unit, multiple second testing units, a classifying unit, and a transferring unit, where the transferring unit, featuring a ball screw and tray, automatically moves semiconductor modules between these units, allowing for serial or parallel connections to streamline the testing process and reduce overall testing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If manual transfer of semiconductor modules is used between testing units, then operational flexibility is maintained, but testing time increases significantly
Solution Approach 1:
The patent replaces manual mechanical transfer with an automated conveying system consisting of a conveying table and positioning mechanism. The conveying table automatically transports semiconductor modules between testing units, eliminating manual intervention and significantly reducing transfer time while maintaining precise positioning capability.
Solution Approach 2:
The system implements self-service through automatic module transfer where the conveying table and positioning mechanism operate autonomously to move modules between testing units without human intervention. The system manages its own workflow from loading to testing to classification, reducing overall testing time.
2Productivity
If a single testing unit is used, then device complexity is reduced, but productivity decreases due to sequential testing
Solution Approach 1:
The patent divides the testing system into multiple independent testing units (first testing unit, second testing unit, etc.) that can operate simultaneously. Each unit is equipped with its own testing apparatus and is connected through the automated conveying system, enabling parallel processing of multiple semiconductor modules and significantly improving productivity.
Solution Approach 2:
The system transitions from single-unit sequential testing to multi-unit parallel testing by adding the dimension of spatial distribution. Multiple testing units are arranged in sequence along the conveying table, allowing simultaneous testing operations in different spatial locations, thereby increasing throughput without proportionally increasing complexity.
3Loss of time
If automated transfer system is implemented, then testing time is reduced, but device complexity increases
Solution Approach 1:
The conveying table serves multiple functions: it conveys modules between testing units, provides positioning alignment, supports automated transfer mechanisms, and enables synchronized operation of multiple testing units. This multi-functionality reduces the need for separate dedicated components for each function, thereby limiting the increase in device complexity despite adding automated transfer capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated system significantly reduces the time required to test semiconductor modules, enabling faster processing of multiple modules and accommodating various types of modules efficiently.
Implementation Method 1
a ball screw connected between the first testing unit and each of the at least one second testing unit, and between the at least one second testing unit and the classifying unit
Data Source
AI summary
A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.