Semiconductor Chip Testing Apparatus with Integrated Blade Block
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Solution Overview
Problem
Existing semiconductor chip testing apparatuses require separate mechanisms for picking and pushing semiconductor chips, leading to increased complexity and potential temperature-related deterioration in test performance.
Innovation Solution
A semiconductor chip testing apparatus that utilizes a single apparatus to perform both picking and pushing of semiconductor chips using a suction airflow generated by a blade block, which holds and electrically connects the chips through a flow path within the upper socket unit, allowing for effective chip handling and temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate mechanisms are used for picking and pushing semiconductor chips, then each function can be performed reliably, but the device complexity increases and blade block replacement is required
Solution Approach 1:
The patent merges the picking function and pushing function into a single blade block structure. The blade block includes a picking unit with suction nozzles for picking up chips and a pushing unit with pushing pins for pushing chips during testing. This integration eliminates the need for separate mechanisms and blade block replacement, reducing device complexity while maintaining reliable chip handling throughout the testing process.
Solution Approach 2:
The blade block is designed as a multi-functional component that performs both picking and pushing operations. The picking unit uses suction nozzles to pick up semiconductor chips, while the pushing unit uses pushing pins to apply force during electrical testing. This universal design allows a single blade block to handle multiple stages of chip processing without requiring replacement.
2Ease of manufacture
If separate blade blocks are used for picking and pushing, then each operation can be optimized, but the loss of time for blade block replacement increases
Solution Approach 1:
The patent combines picking and pushing functions into a single blade block, eliminating the need for blade block replacement between operations. The blade block maintains both picking nozzles and pushing pins simultaneously, allowing continuous operation without time loss for replacement while still optimizing both functions through dedicated structural elements.
Solution Approach 2:
The blade block is pre-configured with both picking and pushing capabilities before the testing process begins. The pushing pins are positioned and ready to act immediately after chip picking, eliminating the need for intermediate replacement actions and reducing overall process time.
3Adaptability or versatility
If multiple components are used for chip handling, then functional requirements are met, but the temperature management becomes more difficult leading to performance deterioration
Solution Approach 1:
The patent integrates picking and pushing functions into a single blade block structure, reducing the total number of components and interfaces. This simplification improves thermal management by minimizing heat generation from multiple actuators and reducing thermal interference between separate mechanisms, thereby maintaining better temperature control during testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simplified testing of semiconductor chips by eliminating the need for separate blade block replacements and effectively manages temperature to prevent performance deterioration during testing.
Implementation Method 1
a blade block coupled to the upper socket unit and formed therethrough with a first suction hole to deliver a vacuum pressure for generating the suction airflow in the receiving space
Implementation Method 2
holds a lower semiconductor chip using a suction airflow passing around the upper semiconductor chip in the receiving space
Data Source
AI summary
A semiconductor chip testing apparatus is disclosed. The semiconductor chip testing apparatus includes: an upper socket unit which is formed therein with a receiving space receiving an upper semiconductor chip, holds a lower semiconductor chip using a suction airflow passing around the upper semiconductor chip in the receiving space, and electrically connects the lower semiconductor chip to the upper semiconductor chip; a blade block coupled to the upper socket unit to deliver a vacuum pressure for generating the suction airflow in the receiving space; and a lower socket unit on which the lower semiconductor chip held by the upper socket unit is seated, and which is electrically connected to the seated lower semiconductor chip.