Semiconductor Testing Handler Socket With Grounded Electrodes
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Solution Overview
Problem
Handler sockets with dielectric support structures limit the achievable voltage for high voltage isolation testing of semiconductor packages due to charging and non-uniform electric field generation, restricting the testing of devices to their full potential and hindering automation and production speed.
Innovation Solution
A system with movable electrodes that position a semiconductor die and conductive terminals within a mold compound, allowing for a first voltage to be applied by one pair of electrodes and a second, lower voltage by another pair, reducing electric field non-uniformity and avoiding dielectric charging, thus increasing the achievable test voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric support structures are used in handler sockets, then the semiconductor package can be supported during testing, but the achievable voltage is limited due to charging and non-uniform electric field generation
Solution Approach 1:
The patent removes the dielectric support structures from the handler socket and replaces them with conductive elements connected to ground. This extraction eliminates the harmful dielectric charging effect while maintaining mechanical support functionality through the conductive ground-connected elements, thereby resolving the voltage limitation caused by dielectric charging.
Solution Approach 2:
The patent changes the electrical parameter of the support structure from dielectric (insulating) to conductive by using ground-connected conductive elements. This parameter change transforms the support structure from a voltage-limiting component to a voltage-dissipating component, enabling higher test voltages while maintaining reliable electrical contact and support.
2Stability of the object's composition
If dielectric support structures are used, then mechanical support is provided, but non-uniform electric fields are generated that restrict testing to full device potential
Solution Approach 1:
The patent extracts the dielectric material from the support structure and replaces it with conductive elements. This removal eliminates the source of non-uniform electric field generation while preserving the mechanical support function through the ground-connected conductive elements, achieving both stable support and uniform electric fields.
Solution Approach 2:
The ground-connected conductive elements act as intermediaries between the semiconductor package and the test system. These intermediaries provide mechanical support while simultaneously maintaining electric field uniformity by conducting excess charge to ground, preventing the field distortion that would occur with dielectric materials.
3Productivity
If automated testing at production speeds is implemented, then productivity increases, but the complexity of the testing system increases
Solution Approach 1:
The handler socket is designed with multi-functionality, serving both as a mechanical support structure and as an electrical grounding system. The ground-connected conductive elements simultaneously provide mechanical positioning and electrical field control, reducing overall system complexity while enabling automated high-speed testing.
Solution Approach 2:
The ground-connected conductive elements in the handler socket automatically manage electric field uniformity and charge dissipation without requiring additional control systems. This self-service functionality simplifies the testing system while maintaining the capability for automated production-speed testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the achievable voltage for high voltage testing while ensuring uniform electric fields, enabling more reliable and efficient testing of semiconductor packages at production speeds without the limitations of dielectric support structures.
Implementation Method 1
allowing for a first voltage to be applied by one pair of electrodes and a second, lower voltage by another pair, reducing electric field non-uniformity
Data Source
AI summary
A method of manufacturing a semiconductor package includes covering a semiconductor die and a plurality of conductive terminals coupled to the semiconductor die in a mold compound, positioning the mold compound between a first pair of electrodes and a second pair of electrodes, and moving a movable electrode of the first pair and a movable electrode of the second pair into a first clamping position. In the first clamping position, each of the first pair of electrodes and the second pair of electrodes electrically couples to a unique subset of the plurality of conductive terminals. The method also includes applying, by the first pair of electrodes, a first voltage to the semiconductor die within the mold compound; and applying, by the second pair of electrodes, a second voltage to the semiconductor die within the mold compound. The second voltage is less than the first voltage.