Semiconductor Testing Lead Extender for High Current
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Solution Overview
Problem
Existing semiconductor device testing equipment faces challenges in applying high magnitude testing currents without damaging the contact probes or the package leads due to high current density.
Innovation Solution
The use of a semiconductor device testing apparatus that includes a package holder, contact test probes, and a lead extender, where the lead extender allows for increased effective contact area, reducing the current density through each contact test probe and enabling higher test currents without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high magnitude testing currents are applied to verify semiconductor package functionality, then the testing capability is improved, but the contact probe and/or package lead may be damaged from burn out due to high current density
Solution Approach 1:
The patent applies segmentation by dividing the current path into multiple segments: the original package lead, the lead extender, and the contact probe. By introducing a lead extender as an intermediate segment with increased surface area, the current is distributed across multiple contact points rather than concentrated at a single probe-lead interface, thereby reducing current density and preventing burnout while enabling high magnitude testing currents
Solution Approach 2:
The lead extender serves as an intermediary component between the contact probe and the package lead. This mediator element provides a larger surface area for current distribution and acts as a buffer that protects both the delicate package lead and the contact probe from high current density damage, enabling safe application of high magnitude testing currents
Data Source
AI summary
A method includes providing a semiconductor package including an encapsulant body and a plurality of leads that protrude out from the encapsulant body; providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender; arranging the semiconductor package within the package holder; actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.