Semiconductor Testing Structure for Leakage Current Detection

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Solution Overview

Problem

As semiconductor devices are scaled down, issues such as leakage current between adjacent capacitor contact structures affect the reliability and yield, which existing technologies have not adequately addressed.

Innovation Solution

The semiconductor device incorporates testing structures with specific arrangements of capacitor contact structures and testing areas to detect leakage current, allowing for the identification and monitoring of defects before capacitor formation, thereby improving reliability and yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If semiconductor devices are scaled down to meet increasing computing demand, then computing ability is improved, but leakage current between adjacent capacitor contact structures increases

Engineering Contradiction:
Improvecomputing abilityVSAvoidleakage current
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent implements testing structures and testing areas that enable detection of leakage current between adjacent capacitor contact structures before the actual capacitor formation process. By performing this detection in advance, defective patterns can be identified and addressed before they affect production capacitors, thus preventing reliability issues while maintaining scaled-down device dimensions for improved computing ability.

Inventive Principle:
Principle #10Preliminary action

2Power

If semiconductor devices are scaled down, then computing ability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvecomputing abilityVSAvoidmanufacturing complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent divides the semiconductor device into distinct testing areas and actual capacitor areas. The testing structures are segmented into separate regions with specific testing contact structures, allowing independent detection and evaluation. This segmentation enables simplified manufacturing processes for each segment while maintaining the overall complexity required for scaled-down high-performance devices.

Inventive Principle:
Principle #1Segmentation

3Reliability

If testing structures are added to detect leakage current, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveleakage current detectionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the testing function into separate testing structures and testing areas that are distinct from the main capacitor structures. By taking out the testing functionality into dedicated regions with specific testing contact structures, the patent enables reliable leakage current detection while keeping the main device structure relatively simple and focused on its primary function.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS11417574B2Semiconductor device with testing structure and method for fabricating the same
Publication Date: 2022.08.16 NAN YA TECH
  • US11417574B2 patent drawing
  • US11417574B2 patent drawing
  • US11417574B2 patent drawing

AI summary

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first testing area, a word line structure positioned in the first testing area and arranged parallel to a first axis, a first column of capacitor contact structures positioned in the first testing area and arranged parallel to a second axis perpendicular to the first axis, a second column of capacitor contact structures positioned adjacent to the first column of capacitor contact structures and arranged parallel to the first column of capacitor contact structures, and a first testing structure including a first drain portion extended along the second axis and a first source portion extended along the second axis. The first drain portion is positioned on the first column of capacitor contact structures and the first source portion is positioned on the second column of capacitor contact structures.