Semiconductor Device Thermal Coating for Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor device mounting structures face challenges in heat dissipation due to gaps between the resin covering the IC package and the reinforcing frame, which divide the heat transfer path and hinder effective heat dissipation.
Innovation Solution
A semiconductor device with a molded part encapsulating the IC package and passive components, covered by a coating composed of conductive particles and resin, which is in contact with exposed interconnection electrodes on the circuit board, enhancing heat transfer and dissipation through thermal radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a reinforcing frame is placed over the main substrate to cover the IC package and resin is injected to encapsulate it, then the connection part between the IC package and main substrate is reinforced, but gaps are formed between the resin and frame which divide the heat transfer path and reduce heat dissipation efficiency
Solution Approach 1:
A heat dissipation member is introduced as an intermediary component between the resin and the frame. This member fills the gap that would otherwise form between these components, providing a continuous thermal conduction path while also reinforcing the structural connection. The heat dissipation member acts as a mediator that simultaneously addresses both the structural strength requirement and the heat dissipation efficiency requirement.
Solution Approach 2:
The heat dissipation member is constructed as a composite structure comprising a porous core made of heat dissipation material and an outer layer. This composite design allows the inner porous structure to provide thermal conduction pathways while the outer layer provides structural integrity and bonding surfaces, enabling the component to fulfill both mechanical reinforcement and thermal management functions simultaneously.
2Temperature
If the heat transfer path from semiconductor component through substrate is used, then heat dissipation is achieved, but the path is divided by air gaps between resin and frame making it difficult to obtain good heat dissipation
Solution Approach 1:
The heat dissipation member serves as a continuous intermediary thermal conduction path between the semiconductor component and the frame, eliminating the need for heat to traverse through air gaps. This member provides an uninterrupted thermal pathway that maintains heat transfer efficiency while simplifying the overall heat dissipation mechanism by removing the complexity of managing discontinuous thermal paths.
3Object-affected harmful factors
If conventional IC package encapsulation with resin is used, then the IC package is protected, but heat dissipation is insufficient due to the insulating nature of resin and formation of air gaps
Solution Approach 1:
The invention merges the protective encapsulation function with the heat dissipation function by integrating the heat dissipation member into the encapsulation structure. The resin continues to provide environmental protection while the heat dissipation member, positioned between the resin and frame, simultaneously provides thermal conduction. This merging eliminates the need for separate protective and thermal management components, addressing both protection and heat dissipation requirements in a unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation by eliminating air gaps and ensuring efficient heat transfer from the semiconductor components to the coating, resulting in better thermal management and reduced device thickness.
Implementation Method 1
a coating covering a surface of the molded part. The coating includes a composite of conductive particles and a resin and is in contact with the first interconnection electrode exposed at the side end face of the first circuit board
Implementation Method 2
the heat dissipation path from the sealing resin covering the semiconductor component and the reinforcing frame by heat radiation is also important
Data Source
AI summary
A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation.