Packaged Semiconductor Thermal Dissipation via Insulation Layer

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Solution Overview

Problem

In memory-based system-in-package (SIP) devices, heat dissipation from logic devices with high power demand is hindered by the limitations of using metal materials due to their high electrical conductivity, which restricts the effective use of metal-based heat transfer components.

Innovation Solution

A packaged semiconductor device design featuring a package substrate with a first semiconductor device, a heat dissipating insulation layer, and a conductive heat dissipation member extending from the insulation layer, along with a protective member to cover the heat dissipation member and prevent cracking, allowing for efficient vertical heat dissipation without electrical interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal materials are used as heat transfer components, then heat dissipation performance is improved, but electrical conductivity causes interference and restricts effective use

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidelectrical interference

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heat dissipation system is segmented into multiple functional layers: a heat dissipation member for thermal conduction, an insulation layer to isolate electrical paths, and a protective member for structural support. This segmentation allows each component to perform its specific function without interference, enabling effective heat dissipation while eliminating electrical conductivity issues.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulation layer is introduced as an intermediary between the heat dissipation member and other components. This intermediary layer blocks electrical interference while allowing thermal energy to pass through, thus resolving the contradiction between needing high thermal conductivity and avoiding electrical conductivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If adhesive members with high thermal conductivity are used, then heat dissipation is improved, but they cannot efficiently transfer heat from logic device to surrounding environment

Engineering Contradiction:

Improveheat dissipationVSAvoidheat transfer efficiency

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The heat dissipation approach transitions from relying solely on adhesive members to using a dedicated heat dissipation member with extended structures (protrusions) that increase surface area for heat transfer. This dimensional change enables more efficient heat dissipation from the logic device to the surrounding environment.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If metal heat dissipation members are used, then thermal conductivity is improved, but they are limited in use on device surfaces due to high electrical conductivity

Engineering Contradiction:

Improvethermal conductivityVSAvoidusage limitation on device surface

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The heat dissipation system uses a composite structure combining a heat dissipation member, an insulation layer, and a protective member. This composite approach allows the system to achieve high thermal conductivity where needed while using insulating and protective materials to eliminate the limitations imposed by metal's high electrical conductivity.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation performance and reliability by utilizing a conductive heat dissipation path while preventing damage to the heat dissipation member during thermal cycles, effectively managing heat from high-power logic devices in SIP systems.

Implementation Method 1

A heat dissipating insulation layer is provided as a coating on the first and second semiconductor devices

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A conductive heat dissipation member is provided, which extends upwardly from the heat dissipating insulation layer and on the first and second semiconductor devices

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11309228B2Packaged semiconductor devices having enhanced thermal transport and methods of manufacturing the same

Publication Date: 2022.04.19 SAMSUNG ELECTRONICS CO LTD

AI summary

A packaged semiconductor device includes a package substrate, a first semiconductor device on the package substrate, and at least one second semiconductor device that extends on and partially covers the first semiconductor device. A heat dissipating insulation layer is provided as a coating on the first and second semiconductor devices. A conductive heat dissipation member is provided, which extends upwardly from the heat dissipating insulation layer and on portions of the first and second semiconductor devices. A protective member is provided on the package substrate, to cover the first and second semiconductor devices and the conductive heat dissipation member. This protective member includes a first covering portion, which covers an upper surface of the conductive heat dissipation member.