Semiconductor Device Thermal Pad Heat Dissipation

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Solution Overview

Problem

The increasing integration density of semiconductor chips leads to heat generation issues, causing component deterioration and malfunction due to inadequate heat dissipation in existing semiconductor devices.

Innovation Solution

A semiconductor device design featuring a resin substrate with a thermal pad and heat conduction portion to efficiently dissipate heat generated by the semiconductor chip, utilizing a thermally conductive material like copper and a solder resist portion with strategically positioned openings for effective heat dissipation and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If integration density of semiconductor chip is increased, then functionality and output are improved, but heat generation increases causing component deterioration and malfunction

Engineering Contradiction:

Improveintegration densityVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the conventional sealed resin package by introducing a heat dissipation opening in the solder resist layer that exposes the thermal pad. This allows heat to be conducted from the semiconductor chip through the substrate to the external thermal pad, where it can dissipate to the environment rather than being trapped inside the package.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a thermal pad as an intermediary thermal conduction path between the semiconductor chip and the external environment. The thermal pad, formed by a via hole filled with conductive material extending through the substrate, serves as a dedicated heat conduction channel that mediates heat transfer from the chip to the outside world.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If conventional resin package sealing is used, then components are protected from environmental influences, but heat dissipation is inadequate

Engineering Contradiction:

Improveprotection from environmental influencesVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent applies local quality by creating a localized opening in the solder resist layer only in the region where heat dissipation is needed (over the thermal pad), while maintaining the protective sealing function in all other areas. The heat dissipation opening is strategically positioned to expose the thermal pad without compromising the overall environmental protection of the package.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The solder resist layer serves multiple functions: it provides electrical insulation, environmental protection, and now also facilitates heat dissipation through the heat dissipation opening. By integrating the heat dissipation function into the existing solder resist structure, the package achieves multi-functionality without adding separate protective components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If thermal pad is completely exposed, then heat dissipation is maximized, but electrical connection reliability may be compromised

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical connection reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies partial action by exposing only the necessary portion of the thermal pad through the heat dissipation opening, rather than completely exposing it. The opening is sized and positioned to provide adequate heat dissipation while maintaining sufficient coverage for reliable electrical connection. The solder resist layer remains intact in surrounding areas to ensure connection reliability.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design efficiently transfers and dissipates heat from the semiconductor chip to the outside, preventing component deterioration and ensuring reliable operation by maintaining the semiconductor chip at a stable temperature.

Implementation Method 1

a heat conduction portion extending through the substrate from the one surface to the other surface of the substrate to connect the island to the thermal pad in a thermally conductive manner

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a solder resist portion provided on the other surface of the substrate and having a heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS7825498B2Semiconductor device

Publication Date: 2010.11.02 ROHM CO LTD

AI summary

A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed relation to the island, a heat conduction portion extending through the substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner, and a solder resist portion provided on the other surface of the substrate and having a heat dissipation opening which defines a gap with respect to an outer periphery of the thermal pad and a terminal opening which exposes the external terminal.