Semiconductor Thermal Pad Through Insulation Layer
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Solution Overview
Problem
Conventional semiconductor devices and manufacturing methods result in high costs, decreased reliability, poor thermal properties, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device design incorporating a semiconductor die, a redistribution structure with insulation layers and conductive traces, and a thermal pad that provides enhanced thermal conductivity, along with an interconnection structure that utilizes both bond pads and dummy pads to create multiple thermal paths for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional semiconductor device structures are used, then manufacturing is simpler, but thermal dissipation is poor
Solution Approach 1:
The device is divided into separate functional components: a semiconductor die for electronic functions, a dedicated thermal management structure with thermal pad and thermal vias for heat dissipation, and a substrate for mechanical support. This segmentation allows each component to be optimized independently, with the thermal structure specifically designed to maximize heat transfer without complicating the semiconductor fabrication process.
Solution Approach 2:
A thermal pad is introduced as an intermediary component between the semiconductor die and the substrate. This thermal pad serves as a dedicated heat transfer medium with high thermal conductivity, mediating the thermal interaction between the die and substrate while allowing the semiconductor die itself to remain unchanged and focused on its primary electronic function.
2Temperature
If larger package sizes are used, then thermal dissipation improves, but device integration density decreases
Solution Approach 1:
The thermal management structure employs local quality enhancement by concentrating high thermal conductivity materials (thermal pad, thermal vias filled with conductive epoxy) precisely where heat generation occurs at the semiconductor die interface. This localized approach maximizes thermal dissipation efficiency at the heat source without requiring the entire package to be enlarged, thereby maintaining compact overall dimensions while achieving superior thermal performance.
3Temperature
If more thermal paths are created, then thermal conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple thermal conduction paths into a unified thermal management structure. The thermal pad is connected to multiple thermal vias, which in turn connect to the substrate, creating parallel thermal paths that function as an integrated system. This merging approach achieves enhanced thermal conductivity through multiple pathways while maintaining manufacturing simplicity, as the entire thermal structure can be fabricated as a single assembly using standard PCB and semiconductor packaging techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal conductivity and reduces package size while maintaining reliability and performance, addressing the limitations of conventional semiconductor devices.
Implementation Method 1
The thermal pad passes through the insulation layer and provides a thermal path between the semiconductor die and the interconnection structure coupled to the first end of the conductive trace
Data Source
AI summary
A semiconductor device includes a semiconductor die, a redistribution structure, a interconnection structure, and a thermal path structure. The redistribution structure includes an insulation layer over a first surface of the semiconductor die and a conductive trace separated from the first surface by the insulation layer. The conductive trace extends laterally over the first surface from a first end toward a second end that is electrically coupled to a bond pad on the first surface of the semiconductor die. The interconnection structure is coupled to the first end of the conductive trace. The thermal path structure provides a thermal path between the semiconductor die and the interconnection structure. In some embodiment, the thermal path structure comprises a thermal pad that passes through the insulation layer. In other embodiments, the thermal path structure comprises a dummy pad on the first surface of the semiconductor die.