Semiconductor Thermal Routing Circuit for Hotspot Dissipation
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Solution Overview
Problem
Conventional semiconductor devices face challenges in heat dissipation due to increased component density and thermal insulation in substrates, leading to uneven temperature distribution and reduced heat dissipation efficiency.
Innovation Solution
The implementation of a thermal routing circuit using graphene structures and metallic materials to route and dissipate thermal energy along non-natural directions, such as horizontal planes, within semiconductor assemblies, along with thermal connectors and vias, to improve heat management and reduce thermal concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat spreaders are used to dissipate heat from semiconductor devices, then heat dissipation is improved, but device footprint is significantly increased
Solution Approach 1:
The patent transitions from conventional horizontal heat spreading to vertical heat dissipation by routing thermal energy through the substrate thickness direction. Thermal vias conduct heat vertically from heat-generating regions through intermediate layers to heat dissipation structures on opposite substrate surfaces, enabling efficient heat removal without increasing lateral footprint.
Solution Approach 2:
The substrate incorporates a thermal circuit network with thermal vias and conductive pathways that create a distributed thermal management structure. This porous-like thermal conduction network allows heat to be efficiently transported through multiple routes within the substrate volume, improving heat dissipation density without expanding device area.
2Temperature
If heat spreaders are used to transfer thermal energy, then heat dissipation is improved, but temperature uniformity deteriorates due to insufficient contacting surface coverage
Solution Approach 1:
The thermal management system is divided into multiple segmented thermal vias and conductive pathways distributed across the substrate. This segmentation creates numerous parallel heat conduction channels that collectively cover heat-generating regions more uniformly, preventing localized hotspots and improving temperature distribution across the device.
Solution Approach 2:
By adding vertical heat conduction pathways through the substrate thickness, the system creates additional thermal management dimensions. This multi-dimensional thermal routing complements horizontal heat spreading, achieving more uniform temperature distribution without relying solely on large contacting surfaces.
3Productivity
If component density is increased, then device functionality is improved, but heat dissipation efficiency deteriorates due to reduced separation distances between components
Solution Approach 1:
The patent utilizes the substrate thickness dimension to route thermal energy vertically, providing an additional heat egress path that is independent of lateral component spacing. This vertical thermal routing allows high-density component arrangements while maintaining effective heat dissipation, as heat can escape through the substrate depth rather than requiring large lateral separation distances.
Solution Approach 2:
The substrate itself acts as an intermediary thermal management structure, with integrated thermal vias and conductive pathways that mediate heat transfer between densely packed components and external heat sinks. This intermediary thermal circuit network enables efficient heat removal from high-density component arrangements without requiring increased component spacing.
4Strength
If conventional substrates with thermal insulation materials are used, then structural integrity is improved, but heat dissipation deteriorates
Solution Approach 1:
The substrate employs composite construction combining thermally insulating materials (such as fiberglass-reinforced epoxy) with thermally conductive elements (thermal vias, metal traces, and heat dissipation structures). This composite approach allows the substrate to maintain its structural integrity and electrical insulation properties while providing dedicated thermal conduction pathways for efficient heat removal from active device regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation by distributing thermal energy over a wider area, reducing hotspots and improving the structural integrity of semiconductor devices, while allowing for simultaneous electrical connections and thermal management.
Implementation Method 1
the thermal circuit can include a thermal transfer layer or trace, a thermal via, a thermal connector, a heat spreader, or a combination thereof
Data Source
AI summary
Semiconductor assemblies including thermal layers and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise one or more semiconductor devices over a substrate. The substrate includes a thermal layer configured to transfer thermal energy across the substrate. The thermal energy is transferred from the semiconductor device to the graphene layer using one or more thermal connectors.