Semiconductor Thick Pad Design for Reliable Solder Connections
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving reliable electrical connections between solder balls and pads, affecting the physical and electrical reliability of the devices, and current manufacturing processes are complex.
Innovation Solution
A semiconductor device design featuring a semiconductor chip with a primary pad and secondary pad, both with the same thickness as the horizontal wiring, and covered by insulation layers, with solder balls placed on both pads to enhance electrical characteristics and reliability, while simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick pad structure is used to improve electrical connection reliability, then the electrical reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The pad structure is divided into two distinct layers: a first pad layer and a second pad layer. This segmentation allows each layer to be formed through separate manufacturing steps, enabling independent optimization of each layer's properties while achieving the overall goal of improved electrical connection reliability through the combined thick pad structure.
Solution Approach 2:
The invention extends the pad structure into the vertical dimension by stacking a first pad layer and a second pad layer. This dimensional approach transforms a conventional single-plane pad into a multi-layer three-dimensional structure, increasing the effective pad thickness and improving electrical connection reliability without requiring excessive lateral space.
2Reliability
If the pad thickness is increased to improve electrical characteristics, then the electrical characteristics are improved, but the manufacturing precision requirements increase
Solution Approach 1:
By dividing the total pad thickness into two separate layers, each layer can be formed with moderate thickness requirements rather than requiring one extremely thick layer. This segmentation relaxes the manufacturing precision requirements for each individual layer while achieving the cumulative effect of a thick pad structure for improved electrical characteristics.
Solution Approach 2:
The invention forms a second pad layer that extends beyond the first pad layer in certain regions, creating an overlapping structure. This partial extension approach ensures adequate electrical connection area and reliability while allowing flexibility in thickness control, as not the entire pad structure requires uniform excessive thickness.
Data Source
AI summary
A semiconductor device may include a semiconductor chip in an encapsulant. A first insulation layer may be disposed on the encapsulant and the semiconductor chip. A horizontal wiring and a primary pad may be disposed on the first insulation layer. A secondary pad may be disposed on the primary pad. A second insulation layer covering the horizontal wiring may be disposed on the first insulation layer. A solder ball may be disposed on the primary pad and the secondary pad. The primary pad may have substantially the same thickness as a thickness of the horizontal wiring.