Semiconductor Thinner Composition for EUV Photoresist EBR Profiles
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Solution Overview
Problem
Existing thinner compositions for removing photoresist in semiconductor manufacturing are inadequate for extreme ultraviolet lithography (EUV), leading to residual photoresist and poor edge bead removal (EBR) characteristics, which hinder the formation of high-integration semiconductor devices.
Innovation Solution
A thinner composition comprising propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, cyclohexanone, and cyclopentanone, with specific weight ratios and additives, is used to efficiently remove photoresist from semiconductor substrates, improving EBR profiles and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single solvent thinner composition is used for removing photoresist in EUV lithography, then the process is simple and cost-effective, but residual photoresist remains and EBR characteristics are poor
Solution Approach 1:
The patent uses a composite thinner composition containing four specific solvents (ethyl cellosolve acetate, methyl methoxy propionate, ethyl lactate, and propylene glycol monomethyl ether) in optimized weight ratios. This composite formulation synergistically improves EBR characteristics and prevents residual photoresist in EUV lithography, resolving the contradiction between manufacturing precision and composition complexity by demonstrating that a carefully designed multi-component system outperforms simpler alternatives.
Solution Approach 2:
The patent systematically varies the weight ratios of each solvent component to optimize performance. By adjusting parameters such as the proportion of ethyl cellosolve acetate (10-40 wt%), methyl methoxy propionate (30-60 wt%), and other components, the formulation achieves optimal EBR characteristics and photoresist removal efficiency for EUV applications.
2Manufacturing precision
If photoresist is applied generously to ensure complete coverage, then coating uniformity is maintained, but excess photoresist residue forms at edge portions requiring additional removal processes
Solution Approach 1:
The thinner composition is applied in a preliminary action before the main photoresist coating process. This pre-treatment step prepares the substrate surface to prevent excessive photoresist accumulation at edge portions during subsequent coating, thereby maintaining coating uniformity while minimizing edge bead formation that would require additional removal processes.
Solution Approach 2:
The thinner composition acts as an intermediary substance applied between substrate preparation and photoresist coating. This intermediary layer controls photoresist flow and distribution, preventing excess accumulation at edges while ensuring complete coverage of the substrate surface, thus resolving the contradiction between coating uniformity and residue prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enhances EBR performance, reduces defects, and improves photoresist application rates, increasing manufacturing efficiency and yield by minimizing unwanted particles and residues.
Implementation Method 1
A thinner composition for removing a resist includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone
Data Source
AI summary
The present disclosure relates to a thinner composition for removing a resist and a processing method of a semiconductor substrate using the thinner composition. Particularly, the thinner composition includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. In addition, the processing method of a semiconductor substrate includes applying a resist composition on a semiconductor substrate and removing the applied resist composition using the thinner composition of the present invention.