Semiconductor Device Three-Layer Structure Warping Reduction
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Solution Overview
Problem
Conventional semiconductor devices with laminated wiring boards tend to become highly asymmetrical and warp due to the asymmetrical structure, which affects antenna performance and stability.
Innovation Solution
A semiconductor device with a three-layer structure of insulating layers, where a third wiring board is interposed between the first and second wiring boards, forming predetermined gaps to regulate spacing and reduce asymmetry, using board-to-board connection members to maintain spacing and improve antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a two-layer laminated structure of wiring boards is used, then the device complexity is reduced, but the structure becomes highly asymmetrical causing warping
Solution Approach 1:
The patent divides the laminated structure into three layers by inserting a third wiring board between the first and second wiring boards. This segmentation creates a more balanced structure that reduces warping while maintaining reasonable complexity. The third wiring board acts as an intermediate layer that distributes thermal and mechanical stresses more evenly.
Solution Approach 2:
The patent introduces predetermined gaps between the third wiring board and the first/second wiring boards, regulated by board-to-board connection members. By changing the spacing parameter and using materials with matched thermal expansion coefficients, the structure achieves better thermal-mechanical balance and reduced warping.
2Reliability
If spacing between wiring boards is increased to improve antenna performance, then the overall thickness increases, but compactness is reduced
Solution Approach 1:
The third wiring board serves as an intermediary structure that enables optimized spacing between the first and second wiring boards. By introducing this intermediate layer with controlled gaps, the patent achieves the necessary distance for antenna performance while distributing the thickness across three layers rather than one large gap.
Solution Approach 2:
The patent transitions from a simple two-layer structure to a three-layer structure with gaps in the vertical dimension. This dimensional change allows optimization of the spacing parameter for antenna performance while managing overall thickness through distributed layering.
Data Source
AI summary
A semiconductor device includes a first wiring board having a first surface mounted with a primary radiator, and a second surface mounted with a semiconductor chip, a second wiring board mounted with a secondary radiator that forms an antenna with the primary radiator, and a third wiring board, arranged between the first and second wiring boards, and forming a predetermined gap with each of the first and second wiring boards. A first board-to-board connection member is arranged between the first and third wiring boards, to form a space between the first and third wiring boards, and regulate the spacing between the first and third wiring boards. A second board-to-board connection member is arranged between the second and third wiring boards, to form a space between the second and third wiring boards, and regulate a spacing between the second and third wiring boards.