Semiconductor Layer Structure for Stable Normally-Off Threshold Voltage

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Solution Overview

Problem

Existing semiconductor devices struggle to maintain stable characteristics, particularly in achieving a high threshold voltage that is stable and consistent with a normally-off operation.

Innovation Solution

The semiconductor device incorporates a p-type third semiconductor layer with magnesium and Alx3Ga1-x3N, along with a first semiconductor layer of Alx1Ga1-x1N and a second semiconductor layer of Alx2Ga1-x2N, to achieve a stable magnesium concentration profile and control the potential of the third semiconductor layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a p-type third semiconductor layer with magnesium is introduced to achieve high threshold voltage, then the threshold voltage stability is improved, but magnesium may be unintentionally introduced into the first semiconductor layer causing instability

Engineering Contradiction:
Improvethreshold voltage stabilityVSAvoidmagnesium concentration profile
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

A second semiconductor layer is introduced as an intermediary barrier between the first semiconductor layer and the p-type third semiconductor layer containing magnesium. This intermediate layer prevents magnesium diffusion into the first semiconductor layer while allowing the third layer to maintain its threshold voltage control function, thus resolving the contradiction between achieving high threshold voltage stability and preventing magnesium contamination.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The semiconductor structure is segmented into multiple distinct layers with different compositions and functions: an first semiconductor layer, a second semiconductor layer, and a p-type third semiconductor layer. This segmentation allows each layer to perform its specific function independently, with the third layer providing threshold voltage control and the second layer preventing magnesium diffusion, thereby achieving both high threshold voltage stability and clean magnesium concentration profiles.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If multiple semiconductor layers are used to control magnesium concentration, then composition stability is improved, but device structure becomes more complex

Engineering Contradiction:
Improvemagnesium concentration profileVSAvoidsemiconductor layer structure
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

Multiple semiconductor layers are merged into a single integrated structure where the first, second, and third semiconductor layers work together as a unified system. This merging achieves stable magnesium concentration profiles and high threshold voltage control without requiring separate processing steps or additional components, thereby reducing overall device complexity while maintaining composition stability.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250040174A1Semiconductor device
Publication Date: 2025.01.30 KK TOSHIBA
  • US20250040174A1 patent drawing
  • US20250040174A1 patent drawing
  • US20250040174A1 patent drawing

AI summary

According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, and third semiconductor layers, and a first insulating member. The first semiconductor layer includes first, second, third, fourth, and fifth partial regions. The third partial region is between the first and second partial regions. The fourth partial region is between the first and third partial regions. The fifth partial region is between the third and second partial regions. The first electrode includes a first electrode portion. The second semiconductor layer includes first and second semiconductor portions. The third semiconductor layer includes first and second semiconductor regions. The second semiconductor region is electrically connected to the first semiconductor region and the first electrode portion. The first insulating member includes a first insulating portion. The first insulating portion is provided between the third partial region and the third electrode.