Semiconductor Device With Through-Electrode Cavity for Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device packaging methods face challenges in increasing packaging density due to difficulties in stacking multiple devices stably, mechanical displacement issues during stacking, and high costs associated with faulty chip discarding and complex mounting processes.
Innovation Solution
A semiconductor device design featuring a semiconductor chip with a resin section that includes a through-hole with a continuously running through electrode, allowing for stable stacking by forming a cavity through the resin section, which facilitates easy stacking and reduces mechanical displacement during vertical stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional packaging methods are used to increase packaging density, then more chips can be packed, but mechanical displacement occurs during stacking making stable stacking difficult
Solution Approach 1:
A resin section is introduced as an intermediary component between the semiconductor chip and the external environment. This resin section contains through-holes that accommodate through-electrodes, serving as a mediator that enables stable vertical stacking by providing a structured interface for mechanical and electrical connection between stacked devices.
Solution Approach 2:
The invention transitions from planar packaging to three-dimensional vertical stacking by introducing through-electrodes that extend through the resin section. This dimensional change allows multiple semiconductor chips to be stacked vertically, increasing packaging density while the resin section provides structural stability for this new configuration.
2Ease of manufacture
If conventional mounting processes are used, then chips can be mounted, but the process becomes complex and costly with high discarding rates for faulty chips
Solution Approach 1:
The through-electrodes are pre-formed within the resin section before chip mounting. This preliminary action simplifies the subsequent mounting process by providing pre-positioned electrical connection paths, reducing the complexity of wire bonding or other post-mounting connection processes, and enabling easier identification and handling of faulty chips.
Data Source
AI summary
A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole.