Semiconductor Package Through Electrode Testing
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Solution Overview
Problem
In semiconductor devices with a Multi-chip Package (MCP) structure, individual semiconductor chips are difficult to test electrically due to mechanical and thermal stress during mounting, leading to chip damage and reduced manufacturing yield, as well as the challenge of forming test electrodes for each chip within the package.
Innovation Solution
A semiconductor package design featuring a through electrode unit that embeds bonding wires connected to electrode pads, with leading ends exposed from both the upper and lower surfaces of the molding unit, allowing for electrical testing from both sides, thereby broadening the range of testing procedures and simplifying the testing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a MCP structure is used to reduce device size, then device compactness is improved, but semiconductor chips may be damaged by mechanical stress or thermal stress during mounting
Solution Approach 1:
Electrical testing is performed on semiconductor chips before they are mounted in the MCP structure. This preliminary testing identifies and isolates defective chips, preventing them from causing damage to other chips during the mounting process through mechanical or thermal stress.
Solution Approach 2:
The system uses the existing bonding wires and electrode pads of each semiconductor chip to perform self-testing. The bonding wires serve dual purposes: as electrical connections and as test paths, eliminating the need for separate test structures.
2Productivity
If multiple semiconductor chips are packaged in a single semiconductor package, then device integration is improved, but electrical testing of individual chips becomes difficult
Solution Approach 1:
The semiconductor package is designed with segmented testing capabilities, where each semiconductor chip can be individually tested through its own bonding wires and electrode pads. This segmentation allows independent testing of each chip even when multiple chips are packaged together.
Solution Approach 2:
The bonding wires and electrode pads serve multiple functions: they act as both electrical connection paths for normal operation and as test paths for electrical testing. This multi-functionality enables testing without adding separate test structures that would increase package complexity.
3Ease of operation
If conventional electrical testing is performed from one side only, then testing simplicity is maintained, but testing coverage and reliability are insufficient
Solution Approach 1:
Electrical testing is performed from both the upper surface and lower surface of the semiconductor package, adding a dimensional aspect to the testing process. This bidirectional testing approach improves testing coverage and reliability while maintaining operational simplicity through standardized test procedures.
Data Source
AI summary
A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit.