Semiconductor Device Through Electrode Packaging Density

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Solution Overview

Problem

Existing semiconductor devices face challenges in achieving high-density packaging due to limitations in electrical connectivity between devices, which restricts the enhancement of packaging density.

Innovation Solution

The semiconductor device incorporates a reinforcing board with through holes and through electrodes, allowing for the electrical connection of additional semiconductor devices via internal connecting terminals, thereby improving packaging density by creating a multi-layered wiring structure that directly connects electronic parts and through electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a reinforcing board with electronic part accommodating portion is provided to reinforce the strength of the semiconductor device, then the strength is improved, but another semiconductor device cannot be electrically connected by laminating

Engineering Contradiction:

Improvestrength of semiconductor deviceVSAvoidelectrical connectivity for high-density packaging

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The reinforcing board is segmented by forming through-holes that penetrate it, allowing through-electrodes to pass through. This segmentation enables the board to serve dual purposes: maintaining structural strength while providing electrical connectivity paths for laminating multiple semiconductor devices together.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention adds a vertical electrical connectivity dimension by introducing through-electrodes that extend through the reinforcing board. This allows electrical connections to be established not only on the surface but also through the thickness of the board, enabling 3D stacking and high-density packaging of multiple semiconductor devices.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Length of stationary object

If the multi-layered wiring structure is directly connected to electronic parts, then the thickness is reduced, but the packaging density cannot be enhanced due to connectivity limitations

Engineering Contradiction:

Improvethickness of semiconductor deviceVSAvoidpackaging density

Core Design Contradiction:

Length of stationary objectVSProductivity

Solution Approach 1:

Through-electrodes are formed in the reinforcing board before the electronic parts are mounted. This preliminary action creates pre-established electrical connection paths that extend through the board, allowing subsequent semiconductor devices to be electrically connected via these pre-formed electrodes, thereby enabling high-density packaging without increasing thickness.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8169072B2Semiconductor device, manufacturing method thereof, and electronic device

Publication Date: 2012.05.01 SHINKO ELECTRIC IND CO LTD

AI summary

A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a back face, a through electrode installed inside the through hole, a first sealing resin filling a gap between the through electrode and an inner wall of the through hole, a second sealing resin filled into the electronic part accommodating portion while causing the bonding face of the electrode pad of the electronic part accommodating portion to be exposed to an outside, and a multi-layered wiring structure configured to include insulating layers laminated on the first face of the reinforcing board and an interconnection pattern, wherein the interconnection pattern is directly connected to the electrode pad of the electronic part and the through electrode.