Semiconductor Device With Through-Hole Wiring Pattern
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Solution Overview
Problem
Conventional semiconductor devices face manufacturing inefficiencies and potential wire defects due to the use of wires for connecting semiconductor chips to leads, which can be flattened or broken during the process.
Innovation Solution
A semiconductor device design that includes a semiconductor element with a protective member featuring a through-hole for a wiring pattern, eliminating the need for wires by electrically connecting the element directly to electrodes, and a method for forming this device using a laser to create the through-holes and metal plating for the wiring pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire is used to connect the semiconductor chip to the lead, then electrical connection is achieved, but the wire may be flattened or broken during manufacturing and the process time increases
Solution Approach 1:
The patent removes the wire from the connection system entirely. Instead of using a separate wire to connect the semiconductor chip to the lead, the invention integrates the connection function directly into the protective member through a wiring pattern formed in a through-hole, thereby eliminating the wire and its associated reliability and productivity issues
Solution Approach 2:
The patent combines multiple functions into the protective member: it serves both as the protective enclosure for the semiconductor chip and as the connection medium through its integrated wiring pattern. This merging eliminates the need for separate wire connections and simplifies the overall structure
2Reliability
If a wire is used to connect the semiconductor chip to the lead, then electrical connection is achieved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The wire and its associated complex connection process are completely removed from the system. The protective member with its integrated wiring pattern provides a simpler, more direct connection method that reduces manufacturing process complexity while maintaining connection stability
Solution Approach 2:
The wiring pattern is pre-formed as part of the protective member structure before the semiconductor chip is enclosed. This preliminary formation of the connection path simplifies the overall manufacturing process by eliminating subsequent wire bonding steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces the risk of wire defects, and allows for a thinner protective member, enhancing the reliability and connectivity of the semiconductor device without the need for external wires.
Implementation Method 1
The through-hole is formed by irradiating the protective member with a laser beam
Implementation Method 2
metal plating for the wiring pattern
Data Source
AI summary
A semiconductor device includes a semiconductor element, an electrode formed on the semiconductor element, and a protective member covering the semiconductor element. The protective member is formed with a through-hole facing the electrode. In the through-hole, a wiring pattern is formed to be electrically connected to the electrode.