Semiconductor Device Through Portion Exposure for Base Member Thickness Reduction
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Solution Overview
Problem
Semiconductor devices with Hall elements face challenges in reducing size while maintaining structural integrity due to the need for a thick base member to encompass through portions, which can weaken the holding force of the base member.
Innovation Solution
The semiconductor device design includes a base member with exposed surfaces of the through portions, allowing for a reduced thickness without compromising holding force, achieved by forming the through portions with larger portions that engage with the base member and using a resin package to enhance structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the base member thickness is increased to entirely encompass the through portion, then the structural integrity and holding force are improved, but the overall device size increases
Solution Approach 1:
The through portion is extracted from being entirely enclosed within the base member and is instead partially exposed on the side surface. This removes the constraint that required the base member to be thick enough to fully contain the through portion, allowing thickness reduction while maintaining holding force through the engaged portion configuration
Solution Approach 2:
The through portion is designed to extend in multiple directions: part of it is exposed on the side surface (lateral dimension) while another part engages within the base member (thickness dimension). This multi-dimensional configuration allows the base member to achieve sufficient holding force without increasing thickness, as the exposed portion provides additional anchoring
2Length of stationary object
If the base member thickness is reduced to make the device thinner, then the device size is reduced, but the holding force of the base member weakens
Solution Approach 1:
The through portion is segmented into two functional parts: an exposed surface portion that extends beyond the base member side surface and a engaged portion that is positioned within the base member thickness. This segmentation allows each part to contribute differently to holding force, enabling thickness reduction while maintaining overall strength
Solution Approach 2:
The engaged portion of the through portion is nested within the base member thickness, while the exposed portion extends outward. This nested configuration maximizes the use of available space, allowing the through portion to achieve sufficient engagement length for holding force without increasing the overall device thickness
Data Source
AI summary
A semiconductor device includes a base member, a wiring portion, a semiconductor element, and a resin package. The base member has an obverse surface, a reverse surface, and a side surface connecting the obverse surface and the reverse surface. The semiconductor element is electrically connected to the wiring portion and arranged on the obverse surface of the base member. The resin package covers the semiconductor element. The wiring portion includes an obverse-surface portion formed on the obverse surface, a reverse-surface portion formed on the reverse surface, and a through portion connecting the obverse-surface portion and the reverse-surface portion. The through portion has an exposed surface exposed from the side surface of the base member and a larger portion. The larger portion has a dimension larger than the exposed surface in a first direction that is perpendicular to the thickness direction and parallel to the exposed surface.