Semiconductor Through Via Wiring via Second Pattern Extraction
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Solution Overview
Problem
The existing methods for manufacturing semiconductor chips with through vias are complex and costly due to the need to etch multiple materials, complicating the formation of through holes and increasing production costs.
Innovation Solution
The solution involves forming a semiconductor chip with a multi-layered wiring structure and a second wiring pattern in the insulating layers to connect through vias to external connection terminals, allowing through holes to be formed by passing through the semiconductor substrate alone, simplifying the etching process and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed by etching multiple materials (insulating films, multi-layered wiring structure, semiconductor substrate), then through vias can be connected to external connection terminals, but the manufacturing process becomes complicated and production cost increases
Solution Approach 1:
The invention extracts the second wiring pattern formation from the through hole etching process. By pre-forming the second wiring pattern in the insulating layers before creating through holes, the complex multi-material etching process is simplified to only require etching the semiconductor substrate, thereby reducing manufacturing process complexity while maintaining electrical connection reliability
Solution Approach 2:
The second wiring pattern is formed in advance (preliminarily) in the insulating layers before the through holes are created. This preliminary action allows the wiring pattern to be ready to receive and conduct electrical signals to the through vias once they are formed, simplifying the overall manufacturing sequence and reducing process complexity
2Manufacturing precision
If through holes are formed by etching multiple materials individually, then through vias can be properly positioned and connected, but production cost increases
Solution Approach 1:
The second wiring pattern is formed preliminarily in the insulating layers with precise positioning before through holes are created. This preliminary wiring pattern serves as a guide and target for through hole formation, ensuring accurate positioning while simplifying the etching process to only the semiconductor substrate, thereby maintaining manufacturing precision while reducing production cost
Solution Approach 2:
The manufacturing process is segmented into distinct stages: first forming the second wiring pattern in insulating layers, then separately forming through holes in the semiconductor substrate. This segmentation allows each process to be optimized independently, maintaining positioning accuracy while reducing overall complexity and cost
Data Source
AI summary
A semiconductor chip includes a semiconductor substrate, a through via provided in a through hole that passes through the semiconductor substrate, insulating layers laminated on the semiconductor substrate, a multi-layered wiring structure having a first wiring pattern and a second wiring pattern, and an external connection terminal provided on an uppermost layer of the multi-layered wiring structure, wherein the through via and the external connection terminal are connected electrically by the second wiring pattern.