Semiconductor Device Tightening Order Display Structures

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Solution Overview

Problem

Conventional semiconductor devices face heat dissipation inefficiencies due to incorrect thread fastening order, leading to insufficient screw tightening and reduced heat dissipation performance.

Innovation Solution

Incorporation of tightening order display structures near thread fastening holes to guide the correct screw tightening sequence, preventing misordering and ensuring proper contact between the heat dissipating plate and external systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thread fastening holes are provided in the heat dissipating plate for fastening to external heat dissipating system, then heat dissipation function is achieved, but incorrect tightening order may reduce heat dissipation performance

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidtightening operation
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The tightening order display structures are pre-provided near the thread fastening holes to indicate the correct tightening sequence before the actual fastening operation. This preliminary visual guidance prevents incorrect tightening order and ensures optimal heat dissipation performance without complicating the operation process.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If tightening order display structures are added near thread fastening holes, then incorrect tightening is prevented, but device complexity increases

Engineering Contradiction:
Improvetightening order accuracyVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The tightening order display structures utilize visual indicators (such as colored markings or numbered displays) near the thread fastening holes to indicate the correct tightening sequence. This approach provides clear guidance without adding complex mechanical or electronic components, thus preventing incorrect tightening while minimizing increases in device complexity.

Inventive Principle:
Principle #32Color changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents incorrect thread fastening, ensuring optimal heat dissipation by facilitating correct screw tightening and reducing the likelihood of partial fastening and tilting issues, thereby enhancing overall performance.

Implementation Method 1

the exposed surface of the heat dissipating plate is brought into contact with an external heat dissipating system, such as a fin, to transfer heat generated by a power chip to the external heat dissipating system through the heat dissipating plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11476180B2Semiconductor device
Publication Date: 2022.10.18 MITSUBISHI ELECTRIC CORP
  • US11476180B2 patent drawing
  • US11476180B2 patent drawing
  • US11476180B2 patent drawing

AI summary

A semiconductor device according to the present application includes: a current carrying unit having a semiconductor element; a case enclosing the current carrying unit; a heat dissipating plate located on a back side of the current carrying unit and the case; a plurality of thread fastening holes located in at least one of the case and the heat dissipating plate for fastening to an external heat dissipating system; and a plurality of tightening order display structures located near the respective thread fastening holes to display an order in which screws are tightened into the thread fastening holes.