Semiconductor TIM Composition for Heat Transfer and Chip Cover Adhesion
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Solution Overview
Problem
Existing thermally conductive interface materials (TIMs) for semiconductor devices suffer from high resistivity, inadequate adhesion, and messy application, leading to inefficient heat transfer and bonding issues.
Innovation Solution
A solventless thermal interface material (TIM) composition comprising metal particles dispersed in a resin with a silane-based adhesion promoter, optionally including rubber and a curing agent, which provides low resistivity and excellent adhesion for bonding semiconductor chips to covers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If paste-like or film-like thermally conductive materials are used, then thermal conductivity is improved, but adhesion between components deteriorates
Solution Approach 1:
The patent uses a composite material consisting of metal particles dispersed in a curable resin matrix. This composite structure combines the high thermal conductivity of metal particles with the adhesive properties of the resin, achieving both thermal conductivity of 8-50 W/m·K and strong adhesion to semiconductor devices and heat sinks.
2Temperature
If grease or paste-like TIM materials are used, then thermal conductivity is improved, but application cleanliness deteriorates
Solution Approach 1:
The patent changes the physical state parameter of the TIM material from liquid/semi-solid grease to a curable resin composition. This allows the material to be applied in a controlled manner and then cured to form a stable, non-migrating interface material that does not bleed or squeeze out, eliminating application messiness while maintaining thermal conductivity.
Solution Approach 2:
The patent utilizes phase transition by applying the TIM material in a curable resin state and then curing it to transform from a soft, potentially messy state to a stable, solidified interface material. This phase change ensures the material remains in place without bleeding onto unwanted areas while providing effective thermal conduction.
3Temperature
If conventional TIM materials are used, then thermal conductivity is improved, but electrical resistivity deteriorates
Solution Approach 1:
The patent employs a composite structure with metal particles (such as aluminum, copper, or silver) dispersed in a curable resin. This composite provides both high thermal conductivity and adequate electrical resistivity, as the resin matrix acts as an electrical insulator while the metal particles conduct heat, achieving thermal conductivity of 8-50 W/m·K and electrical resistivity greater than 10^-5 Ω·cm.
4Temperature
If film-like TIM materials are used, then thermal conductivity is improved, but manufacturing complexity deteriorates
Solution Approach 1:
The patent extracts the unnecessary film-forming agents from conventional film-like TIM materials, using only the essential curable resin and metal particle components. This simplifies the material composition and manufacturing process while maintaining thermal conductivity performance, eliminating complex multi-layer film structures and additional chemical additives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TIM composition achieves effective thermal conductivity and strong adhesion, ensuring efficient heat transfer and reliable bonding between semiconductor chips and covers, even after multiple operation cycles.
Implementation Method 1
a silane-based adhesion promoter
Implementation Method 2
metal particles dispersed in a resin
Implementation Method 3
a curing agent... curing the component assembly to bond the cover and the semiconductor chip
Data Source
AI summary
A semiconductor device including a semiconductor chip formed from a semiconductive material and a cover formed from a conductive material is provided. The semiconductor chip and cover are bonded with a thermal interface material composition that includes metal particles dispersed in a resin or resin blend and a silane-based adhesion promoter. The TIM composition may also include a rubber and a curing agent. Methods of making semiconductor devices are also provided.