Semiconductor Module Cooling Interface to Contain TIM Leakage

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Solution Overview

Problem

The leakage of thermal interface material over time between the semiconductor module and the cooler in semiconductor devices leads to deterioration of heat dissipation and poor insulation.

Innovation Solution

The outer conductor film of the semiconductor module has a protruding or recessed portion on its surface in contact with the thermal interface material, which restricts the outward flow of the material, and is disposed on an insulator substrate with a small linear expansion coefficient to minimize thermal deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermal interface material is used between the semiconductor module and the cooler, then heat dissipation efficiency is improved, but the material leaks over time causing deterioration of heat dissipation and insulation

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidinsulation performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The protruding portion is formed on the outer conductor film before assembly, creating a pre-positioned barrier that prevents thermal interface material from leaking outward. This preliminary structural feature ensures that even after prolonged operation, the material remains contained and maintains both heat dissipation efficiency and insulation performance.

Inventive Principle:

Principle #10Preliminary action

2Temperature

If thermal interface material is applied to ensure good thermal contact, then heat dissipation is improved, but the material flows outward over time causing poor insulation

Engineering Contradiction:

Improvethermal contact qualityVSAvoidmaterial leakage

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The outer conductor film is designed with a localized protruding portion at the specific location where thermal interface material contact occurs. This localized structural modification creates a barrier exactly where material leakage is problematic, while maintaining good thermal contact quality in the contact region and preventing harmful material flow outward.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses the leakage of thermal interface material, maintaining efficient heat dissipation and insulation over time.

Implementation Method 1

The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an insulator substrate with a small linear expansion coefficient to minimize thermal deformation

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250062180A1Semiconductor device

Publication Date: 2025.02.20 DENSO CORP

AI summary

The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.