Vibration Isolation for Semiconductor Tool Pedestals
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Solution Overview
Problem
Semiconductor fabrication facilities face challenges in isolating low-frequency vibrations that affect production tools, such as lithograph tools, due to outdated vibration specifications in older support tools, leading to reduced production yield and the need for costly replacements.
Innovation Solution
A method and system using soundproofing materials and adhesives to fill hollow steel and aluminum support members, combined with mechanical fastening and vibration-absorbing foam, to create a hybrid vibration isolation system that reduces vibration transmission from the floor to high-precision equipment, allowing newer tools with tighter vibration frequency requirements to operate with older tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If hollow steel and aluminum support members are used to minimize weight and cost, then ease of manufacture and material handling is improved, but vibration isolation capability deteriorates
Solution Approach 1:
The patent fills hollow steel and aluminum support members with vibration-absorbing materials such as foam, rubber, or other porous damping materials. This transforms the hollow structural members into composite vibration-isolating members that maintain structural integrity while providing superior vibration attenuation compared to empty hollow sections.
Solution Approach 2:
The patent creates composite structures by combining metal support members with vibration-absorbing materials. The hybrid composite construction leverages the strength and stiffness of metal frameworks while incorporating the vibration-damping properties of foam, rubber, or viscoelastic materials to achieve both structural and vibration isolation requirements.
2Reliability
If vibration isolation measures are added to older support tools, then vibration control for newer tools is improved, but device complexity increases
Solution Approach 1:
The patent integrates vibration isolation functionality directly into the existing support tool structures by filling hollow members and applying surface treatments. This merging approach combines structural support and vibration isolation into a single integrated system, avoiding the need for separate complex isolation mechanisms and maintaining simplicity.
Solution Approach 2:
The patent introduces vibration-absorbing materials as intermediary elements between the support tool structure and the equipment being supported. These intermediary materials (foam, rubber, viscoelastic compounds) act as mediators that decouple vibration transmission paths without requiring fundamental redesign of the support tools.
3Object-affected harmful factors
If heavier vibration isolation components are used, then vibration isolation performance is improved, but weight increases
Solution Approach 1:
The patent employs thin layers of viscoelastic materials, damping compounds, and flexible membranes applied to or within the support members. These thin flexible layers provide effective vibration isolation without adding significant weight, leveraging material properties rather than mass for damping performance.
Solution Approach 2:
The patent changes the physical and chemical parameters of the support members by filling hollow sections with vibration-absorbing materials and applying surface treatments. This transforms the structural parameters of the support members to provide vibration isolation inherent to the modified structure itself, eliminating the need for separate heavy isolation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces low-frequency vibrations, improves production yields, extends the life of older equipment, and reduces costs by enabling the use of existing infrastructure, while maintaining minimal weight and ease of installation, thus enhancing operational efficiency and profitability.
Implementation Method 1
A vibration absorbing foam fills a hollow portion of a vertical support structure separating the base from the upper surface
Implementation Method 2
A first vibration isolation pad structure separates the base of the elevated structure from the floor. A second vibration isolation pad structure separates the vertical support structure from the upper structure of the elevated structure
Data Source
AI summary
A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.