Semiconductor Tool Diagnostics Using Soundness Indicators

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Solution Overview

Problem

Existing apparatus diagnostic systems for plasma etching apparatuses are inflexible and require modifications when new components or sensors are added, and lack the ability to analyze conditions using arbitrary triggers, leading to inefficient maintenance and prolonged downtime.

Innovation Solution

A system that collects sensor data from plasma etching apparatuses via a LAN and executes registered analysis algorithms without modifying the system program, using arbitrary triggers to calculate soundness indicators and perform predictive maintenance with AI-based learning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the system is modified one by one for each new component or sensor added to the apparatus, then the system can accommodate new components, but the rate of operation decreases due to frequent modifications and maintenance interruptions

Engineering Contradiction:
Improveadaptability to new components and sensorsVSAvoidrate of operation
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent implements a universal data collection framework that can accommodate any sensor or component through standardized interfaces. The system uses a common data structure and analysis algorithm that works with diverse sensor types without requiring system modifications, enabling the system to handle new components while maintaining continuous operation and high productivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If non-regular maintenance work is performed due to unexpected malfunctions, then apparatus reliability is maintained, but downtime increases significantly due to resource adjustment and part procurement

Engineering Contradiction:
Improveapparatus reliabilityVSAvoiddowntime
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent implements continuous monitoring and predictive analysis that detects component degradation trends before failure occurs. By analyzing sensor data patterns and predicting potential malfunctions in advance, the system enables scheduled maintenance during planned downtime, preventing unexpected breakdowns and eliminating the need for urgent resource adjustment and part procurement.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system continuously collects sensor data, analyzes it using predefined algorithms, and provides feedback on component health status. This feedback mechanism enables early detection of degradation patterns, allowing maintenance to be scheduled at optimal times rather than responding to failures, thereby reducing unplanned downtime while maintaining reliability.

Inventive Principle:
Principle #23Feedback

3Ease of operation

If the analysis trigger is limited to recipe information only, then the analysis system is simple to operate, but the measurement precision of component state evaluation is insufficient

Engineering Contradiction:
Improveease of operationVSAvoidprecision of component state evaluation
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent implements a dynamic trigger system that automatically selects analysis triggers based on the specific component being evaluated and its operational characteristics. The system can switch between recipe-based triggers, time-based triggers, and event-based triggers depending on the component type, providing both ease of operation through automation and high measurement precision through appropriate trigger selection.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12530023B2Apparatus diagnostic system, apparatus diagnostic apparatus, semiconductor device manufacturing system, and apparatus diagnostic method
Publication Date: 2026.01.20 HITACHI HIGH TECH CORP
  • US12530023B2 patent drawing
  • US12530023B2 patent drawing
  • US12530023B2 patent drawing

AI summary

An apparatus diagnostic system for diagnosing conditions of a semiconductor manufacturing apparatus includes an apparatus diagnostic apparatus that outputs soundness indicators by a first algorithm with sensor data collected from the semiconductor manufacturing apparatus as an input to the first algorithm, outputs threshold spatial data under normal conditions of the semiconductor manufacturing apparatus by a second algorithm with the soundness indicators as an input to the second algorithm, and diagnoses conditions of the semiconductor manufacturing apparatus by a third algorithm with the soundness indicators and the threshold spatial data as an input to the third algorithm. The soundness indicators are indicators concerning a degree of soundness of conditions of the semiconductor manufacturing apparatus.