Semiconductor Tool Weight Placement for Low-Frequency Vibration
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Solution Overview
Problem
Low frequency vibrations in semiconductor manufacturing facilities affect production tools, leading to reduced production yield rates due to defects such as pits, bumps, and line defects caused by equipment shaking during processes like thin film deposition.
Innovation Solution
Attaching weights or masses to semiconductor manufacturing apparatus to increase its mass, thereby reducing susceptibility to vibrations, using materials like metal blocks or plates, and employing damping materials to secure the weights and limit vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If weights are attached to semiconductor manufacturing apparatus to reduce vibration, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The vibration reduction system is segmented into multiple independent weights that can be attached to different locations on the apparatus. Each weight addresses specific vibration frequencies or locations, allowing the system to be divided into manageable components rather than requiring a single complex vibration reduction mechanism.
Solution Approach 2:
The patent transitions from addressing vibration in a single dimension to multi-dimensional vibration control by attaching weights at various locations around the apparatus. This spatial distribution of weights creates a comprehensive vibration reduction system that addresses vibrations from multiple directions and frequencies simultaneously.
2Manufacturing precision
If damping materials are used to secure weights and limit vibration transmission, then manufacturing precision is improved, but loss of energy increases
Solution Approach 1:
Damping materials are pre-installed between the weights and the apparatus structure to cushion against vibration transmission before the vibration occurs. This beforehand cushioning prevents vibration energy from transmitting to the apparatus, protecting the manufacturing process from vibration-induced defects while managing energy dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The added weights significantly reduce vibrations, enhancing equipment stability and minimizing defects in semiconductor devices, allowing for improved manufacturing precision and yield.
Implementation Method 1
Attaching weights or masses to semiconductor manufacturing apparatus to increase its mass, thereby reducing susceptibility to vibrations
Implementation Method 2
employing damping materials to secure the weights and limit vibration transmission
Data Source
AI summary
A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.