Semiconductor Transfer Printing Alignment via Lock-and-Key Markers
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Solution Overview
Problem
Current transfer printing methods for coupling semiconductor components to substrates suffer from insufficient alignment accuracy, particularly when transferring large arrays of coupons, resulting in misalignment issues that are less than desirable for photonic components.
Innovation Solution
The method involves forming enlarged coupons with solid alignment markers on the underside and corresponding hollow alignment markers on the target substrate, allowing for improved alignment through a lock-and-key engagement mechanism, enhancing the alignment accuracy from 1.5 μm 3σ to approximately 0.5 μm 3σ by using a flexible stamp for transfer printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple coupons are transferred simultaneously using a soft elastomeric stamp, then high-throughput integration is achieved, but alignment accuracy deteriorates to 1.5 μm 3σ
Solution Approach 1:
The patent divides the alignment function into two parts: coarse alignment using visual markers and fine alignment using the lock-and-key mechanism with solid and hollow alignment markers. This segmentation allows simultaneous transfer of multiple coupons while achieving sub-micrometer alignment accuracy for each coupon relative to the target substrate.
Solution Approach 2:
The patent introduces alignment markers as intermediary elements that mediate between the coupon and target substrate. The solid alignment markers on the coupon engage with hollow alignment markers in the target substrate, acting as a mechanical intermediary that ensures precise alignment during the transfer process.
2Ease of operation
If visual alignment markers are used for transfer printing, then alignment can be achieved, but alignment accuracy is insufficient for photonic components
Solution Approach 1:
The alignment process is segmented into two stages: initial coarse alignment using visual markers and final precise alignment using the lock-and-key mechanism. This two-stage approach maintains ease of operation while achieving the required sub-micrometer alignment accuracy for photonic components.
Solution Approach 2:
The patent performs preliminary coarse alignment using visual markers before the final placement. This preliminary action positions the coupon near the target location, after which the lock-and-key mechanism completes the precise alignment, combining ease of operation with high precision.
Data Source
AI summary
The disclosure is related to a method for producing at least one semiconductor component coupled to a target substrate, where a coupon comprising one or more constituent layers of the at least one semiconductor component is transferred to the target substrate by transfer printing. The coupon is embedded in a portion of a support layer thereby forming an enlarged coupon provided with solid alignment markers on the underside thereof. Corresponding hollow alignment markers exist on the location of the target substrate where the coupon is to be placed. The alignment markers engage to thereby align the coupon to the target location. The disclosure is equally related to a device assembly obtainable by the method.