Device, apparatus, and method for semiconductor transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor transfer technologies face challenges in achieving high accuracy and efficiency during the mass transfer of micro-LEDs from wafers to substrates, leading to inaccuracy in welding due to the difficulty in precise positioning of semiconductor chips.
Innovation Solution
A device and method for semiconductor transfer that utilizes a transfer substrate with an infrared emitting portion for precise positioning and a magnetic portion for accurate alignment and placement of semiconductor chips, enabling horizontal adjustment of the chips relative to the target substrate using electromagnetic forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transfer of semiconductor chips is performed simultaneously, then productivity is improved, but manufacturing precision deteriorates due to positioning inaccuracy
Solution Approach 1:
The patent replaces traditional mechanical positioning systems with an electromagnetic positioning system. Electromagnetic portions generate magnetic fields that interact with magnetic portions on the transfer substrate to precisely control the position of semiconductor chips during mass transfer, achieving high positioning accuracy without sacrificing transfer efficiency
Solution Approach 2:
The patent introduces electromagnetic fields as an intermediary between the positioning system and semiconductor chips. The electromagnetic portions and magnetic portions create a controllable magnetic field environment that enables precise positioning of multiple chips simultaneously, solving the contradiction between mass transfer and positioning accuracy
2Manufacturing precision
If traditional transfer methods are used, then device complexity is reduced, but manufacturing precision deteriorates due to inability to accurately position semiconductor chips
Solution Approach 1:
The patent designs electromagnetic portions that serve multiple functions: generating magnetic fields for positioning, controlling movement of the transfer substrate, and enabling precise alignment of semiconductor chips. This multi-functionality reduces the need for separate positioning mechanisms, thereby limiting the increase in device complexity while achieving high positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures accurate alignment and placement of semiconductor chips during transfer, preventing inaccuracy in welding and enhancing the overall efficiency and yield of the micro-LED packaging process.
Implementation Method 1
The controller is configured to output a first control current to the first electromagnetic portion to cause the first electromagnetic portion to generate an electromagnetic force, to control the second magnetic portion to adjust a horizontal position of the picked-up semiconductor relative to the target substrate
Implementation Method 2
a second magnetic portion movably disposed in the first electromagnetic portion and configured to pick up a semiconductor from a target substrate
Implementation Method 3
The infrared emitting portion is configured to emit infrared signals to position the semiconductor on the target substrate
Data Source
AI summary
A device, apparatus, and method for semiconductor transfer are provided. A transfer substrate is controlled to be moved to be above the target substrate. An infrared emitting portion emits infrared signals to position a semiconductor on a target substrate. After a second magnetic portion picks up the semiconductor from the target substrate, a controller outputs a first control current to a first electromagnetic portion to cause the first electromagnetic portion to generate an electromagnetic force, to control the second magnetic portion to adjust a position of the picked-up semiconductor relative to the welding position on the target substrate, where adjusting the position of the picked up semiconductor includes horizontal adjustment.