Semiconductor Component Transfer via Auxiliary Carrier
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Solution Overview
Problem
The existing methods for producing semiconductor components result in a significant proportion of finished products being non-functional or not meeting predetermined requirements, leading to increased production costs and inefficiencies.
Innovation Solution
A method involving the deposition of a semiconductor layer sequence on a substrate, followed by transfer to auxiliary carriers for mechanical stabilization and separation, allowing for the removal of the substrate and selective transfer of functional semiconductor bodies to connection carriers, ensuring adherence to requirements through testing and localized adhesive modification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor components are produced using conventional production steps, then manufacturing process is simple, but a large proportion of finished components are non-functional or do not meet requirements
Solution Approach 1:
The patent applies preliminary action by performing functional testing of semiconductor bodies on the substrate before transfer to connection carriers. This allows identification and separation of functional from non-functional bodies in advance, ensuring only working components are transferred, thereby significantly improving functional yield while maintaining a manageable production process
Solution Approach 2:
The production process is segmented into distinct stages: substrate-based manufacturing and testing, then transfer to connection carriers. This segmentation allows independent optimization of each stage, with testing performed on the substrate before transfer, enabling better quality control without overwhelming process complexity
2Loss of substance
If substrate is removed and reused, then production costs are reduced, but mechanical stability during production is compromised
Solution Approach 1:
The patent introduces auxiliary carriers as intermediary elements that temporarily support semiconductor bodies during transfer operations. These carriers provide the necessary mechanical stability during handling and bonding processes, while the substrate itself is removed and reused, thus reducing substrate costs without compromising stability during critical production steps
Solution Approach 2:
The substrate is extracted from the final component structure and reused for new semiconductor layer deposition. Auxiliary carriers are introduced specifically for transfer operations, allowing the substrate to be removed entirely after semiconductor body formation, enabling substrate reuse and cost reduction while maintaining stability through the auxiliary carrier system
3Manufacturing precision
If selective transfer of functional semiconductor bodies is implemented, then production quality is improved, but production time and process complexity increase
Solution Approach 1:
Functional testing is performed as a preliminary action on the substrate before transfer to connection carriers. This early identification of functional bodies allows for selective transfer based on actual performance, improving manufacturing precision. The testing and selection occur in parallel with other production activities, minimizing additional production cycle time
Solution Approach 2:
The testing, selection, and transfer operations are merged into an integrated process flow on the substrate. By combining these functions in sequence on the same platform, the patent avoids separate handling steps that would increase production time, achieving precise selective transfer with minimal time penalty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the production of non-functional semiconductor components by ensuring only functional bodies meet requirements, allowing for cost-effective reuse of substrates and improved electronic and spectral characteristics.
Implementation Method 1
The semiconductor layer sequence is preferably deposited epitaxially on the substrate, for example by means of MOCVD or MBE
Implementation Method 2
The punch may be brought into thermal contact with the second auxiliary carrier and so bring about input of heat
Implementation Method 3
the substrate is removed
Data Source
AI summary
A method is provided for producing a semiconductor component (1) comprising at least one semiconductor body (2) and one connection carrier region (5). A semiconductor layer sequence (20) with an active region (23) intended for generating radiation is deposited on a substrate (25). The semiconductor layer sequence is arranged on a first auxiliary carrier (3) and the substrate is removed. A plurality of semiconductor bodies are formed from the semiconductor layer sequence. A second auxiliary carrier (4) is arranged on the side of the semiconductor layer sequence remote from the first auxiliary carrier. The first auxiliary carrier is removed. A connection carrier (50) with a plurality of connection carrier regions (5) is provided. The second auxiliary carrier is positioned relative to the connection carrier in such a way that at least one of the semiconductor bodies overlaps an associated connection carrier region when viewed in plan view. The at least one semiconductor body is transferred onto the connection carrier region.