Semiconductor Transfer via Molybdenum Oxide Layer
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Solution Overview
Problem
The challenge lies in manufacturing semiconductor devices, particularly thin film transistors and light-emitting elements, on flexible substrates like plastic films, which are prone to deformation, contamination, and have lower heat resistance compared to glass substrates, making it difficult to achieve high yield and accuracy in mass production while maintaining the quality and characteristics of conventional semiconductor devices.
Innovation Solution
A method involving the formation of a molybdenum film, molybdenum oxide film, nonmetal inorganic film, and organic compound film on a substrate, allowing for the separation and transfer of semiconductor elements from glass substrates to flexible substrates at a low temperature, utilizing the brittleness of molybdenum oxide to facilitate separation with minimal force and avoiding the need for heat treatment or plasma irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor elements are formed directly on flexible substrates using low-temperature processes, then the substrate can be flexible and lightweight, but the manufacturing precision and yield are reduced due to substrate deformation and contamination
Solution Approach 1:
The manufacturing process is divided into two independent stages: first, semiconductor elements are fabricated on rigid glass substrates with high precision using conventional equipment; second, the completed elements are separated and transferred to flexible substrates. This segmentation allows each stage to optimize for its specific requirements without compromise
Solution Approach 2:
Glass substrates serve as an intermediary medium that enables high-precision manufacturing while ultimately allowing transfer to flexible substrates. The glass substrate provides a stable platform during fabrication, then the completed elements are moved to the final flexible substrate, mediating between the conflicting requirements of precision and flexibility
2Manufacturing precision
If conventional glass substrates are used for manufacturing, then manufacturing precision and equipment compatibility are maintained, but the final device cannot be flexible or lightweight
Solution Approach 1:
The device structure is segmented into the semiconductor element layer and the substrate layer. The element layer is fabricated on glass with high precision, then transferred to a separate flexible substrate. This allows the heavy glass to be used only during manufacturing, while the final device uses a lightweight flexible substrate
Solution Approach 2:
The semiconductor elements are essentially copied from the glass substrate manufacturing environment to the flexible substrate final application. The elements retain their high-precision characteristics from glass substrate fabrication while gaining the flexibility and lightness of the new substrate
3Ease of manufacture
If heat treatment or plasma irradiation is applied to plastic films for semiconductor fabrication, then the semiconductor elements can be formed, but the plastic films deform or become contaminated
Solution Approach 1:
The harmful high-temperature and plasma processes are segmented and isolated to only the glass substrate manufacturing stage. The flexible plastic substrate is introduced only after these harmful processes are complete, during the gentle transfer stage, thus avoiding exposure to deformation and contamination risks
Solution Approach 2:
All semiconductor element formation, including heat treatment and plasma irradiation, is performed preliminarily on the glass substrate before the flexible substrate is introduced. This preliminary action completes all harsh processing while the substrate is in its most robust glass form, protecting the flexible substrate from damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of flexible, thin, and large semiconductor devices with improved yield and reduced contamination, allowing for the use of existing manufacturing equipment and minimizing equipment costs, while maintaining the quality of semiconductor elements on flexible substrates.
Implementation Method 1
utilizing the brittleness of molybdenum oxide to facilitate separation with minimal force
Data Source
AI summary
An object of the invention is to provide a method for manufacturing semiconductor devices that are flexible in which elements fabricated using a comparatively low-temperature (less than 500° C.) process are separated from a substrate. After a molybdenum film is formed over a glass substrate, a molybdenum oxide film is formed over the molybdenum film, a nonmetal inorganic film and an organic compound film are stacked over the molybdenum oxide film, and elements fabricated by a comparatively low-temperature (less than 500° C.) process are formed using existing manufacturing equipment for large glass substrates, the elements are separated from the glass substrate.