Semiconductor Transfer Mechanism Side Exhaust Particle Control
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Solution Overview
Problem
In semiconductor manufacturing apparatuses, the longitudinal movement of transfer mechanisms generates particles that contaminate wafers and damage resist patterns, and existing solutions like partition walls and filters are inadequate for complete particle collection, especially when the number of blocks increases, complicating maintenance and wafer processing efficiency.
Innovation Solution
A semiconductor manufacturing apparatus with a transfer mechanism, processing units, and an exhaust chamber that uses a suction exhaust line and gas injection unit to create a negative pressure air flow, guiding particles into the exhaust chamber for removal, while maintaining a positive pressure atmosphere in the transferring passage to prevent particle scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a partition wall with filter is installed between vertically disposed adjacent blocks to remove particles, then particle removal capability is improved, but the thickness of the partition wall becomes larger and the height of the apparatus becomes considerably increased
Solution Approach 1:
The invention changes the exhaust approach from vertical (through partition walls between stacked blocks) to horizontal (through exhaust ports on the side surfaces of blocks). By providing exhaust ports on side surfaces and guiding air flows horizontally outward, the system achieves effective particle removal without increasing apparatus height, thus resolving the contradiction between particle removal capability and compact structure.
2Productivity
If the number of stacked blocks is increased to enhance processing capability, then wafer processing capability is improved, but the height of the apparatus becomes considerably increased making maintenance difficult
Solution Approach 1:
The invention enables side-surface exhaust on each block, allowing independent exhaust control for each unit. This modular side exhaust approach maintains processing capability while improving maintenance accessibility, as each block can be serviced independently without requiring the entire stacked structure to be accessed from above.
3Object-affected harmful factors
If a filter is provided on the partition wall to remove particles, then particle collection is improved, but the thickness of the partition wall becomes larger
Solution Approach 1:
The invention extracts the exhaust function from the partition wall structure and implements it independently on each block through side surface exhaust ports. This eliminates the need for thick partition walls with embedded filters, achieving particle removal while maintaining a compact, thin-walled block structure.
4Ease of operation
If the transfer mechanism moves longitudinally along the transferring passage, then wafer transfer between processing units is enabled, but a large amount of particles are generated from the guide rail and driving mechanism
Solution Approach 1:
The invention converts the harmful air flows and particles generated by the moving transfer mechanism into beneficial particle removal by providing exhaust ports that capture these flows. The side-surface exhaust ports are strategically positioned to intercept particles and air flows generated during wafer transfer, transforming a harmful byproduct into an effective particle collection mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces particle contamination on wafers by entraining generated particles in the air flow and removing them from the processing area, enhancing wafer processing efficiency and maintaining a cleaner environment for precise resist pattern formation.
Implementation Method 1
an exhaust chamber (52) having a gas exhaust opening (51) at the side of the transferring passage (R1), the exhaust chamber (52) being provided under the processing units (U1 to U4)... a suction exhaust line (59) connected to the exhaust chamber (52)... an air flow to be drawn into the gas exhaust opening (51) via the transferring passage (R1)
Implementation Method 2
maintaining a positive pressure atmosphere in the transferring passage to prevent particle scattering
Implementation Method 3
a guide member (66) provided inside the exhaust chamber (52) or at a position facing the opening (51), the guide member (66) extending along the transferring passage (R1)... guiding particles into the exhaust chamber for removal
Data Source
AI summary
A semiconductor manufacturing apparatus includes a transfer mechanism including a moving part for holding a substrate to be processed and moving along a longitudinal transferring passage and a plurality of processing units for performing respective processes on the substrate. The processing units are disposed along the transferring passage and the substrate is transferred between the processing units and the transfer mechanism. An exhaust chamber is provided under the processing units, the exhaust chamber having a gas exhaust opening at the side of the transferring passage, the exhaust chamber. Further, a suction exhaust line is connected to the exhaust chamber, and a guide member is provided inside the exhaust chamber or at a position facing the opening, wherein the guide member extends along the transferring passage.