Semiconductor Transformer Layout for Crosstalk Isolation
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Solution Overview
Problem
Existing semiconductor devices face inefficiencies in production due to the need to cut out semiconductor chips with a predetermined number of transformers, leading to excess chips and reduced production efficiency, and also suffer from crosstalk noise and electrical noise interference in signal transmission.
Innovation Solution
A semiconductor device design featuring a semiconductor substrate with overlapping patterns magnetically or capacitively coupled, allowing for efficient cutting of semiconductor wafers into chips with transformers, and using transformers to transmit signals between circuits with different potentials while suppressing electrical noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are cut out with a predetermined number of transformers from one semiconductor wafer, then the required number of transformers can be obtained, but production efficiency decreases due to excess chips
Solution Approach 1:
The semiconductor wafer is designed with a matrix arrangement of transformer patterns that can be cut into chips with different numbers of transformers (e.g., 1, 2, or 3 transformers per chip). This universal design allows a single wafer to produce multiple product variants, eliminating waste from excess chips and improving production efficiency.
2Reliability
If transformers are used for signal transmission between different potentials, then electrical noise is suppressed, but crosstalk noise between adjacent transformers increases
Solution Approach 1:
A ground pattern is extracted and positioned between adjacent transformer patterns to electrically isolate them. This ground pattern acts as a shielding barrier that prevents crosstalk noise between transformers while maintaining the benefits of electrical noise suppression through inductive coupling for signal transmission.
Solution Approach 2:
The ground pattern serves as an intermediary element between adjacent transformers. It provides electrical isolation and noise shielding without interfering with the magnetic coupling function of the transformers, thus reducing crosstalk while maintaining signal transmission reliability.
3Adaptability or versatility
If multiple transformers are arranged on a semiconductor chip, then signal transmission capability is improved, but device complexity increases
Solution Approach 1:
Multiple transformer patterns are merged into a single matrix arrangement on the semiconductor wafer, sharing common structural elements and manufacturing processes. This combining approach allows multiple transformers to coexist on one chip without proportionally increasing complexity, as they follow a unified design pattern that simplifies fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the performance and production efficiency of semiconductor devices by enabling reliable signal transmission between circuits with different potentials and reducing manufacturing costs through versatile chip designs.
Implementation Method 1
an upper pattern and a lower pattern that overlap each other in plan view and are magnetically or capacitively coupled to each other
Implementation Method 2
an upper pattern and a lower pattern that overlap each other in plan view and are magnetically or capacitively coupled to each other
Data Source
AI summary
A semiconductor device includes a semiconductor substrate including a p-type semiconductor and an n-type semiconductor region arranged on the p-type semiconductor region; a first pattern overlapping the n-type semiconductor region in plan view and formed over the semiconductor substrate; and a second pattern overlapping the first pattern in plan view and magnetically or capacitively coupled to the first pattern.