Semiconductor Die with Transmissive Layer for External Stimuli
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Solution Overview
Problem
There is a need for a cost-effective semiconductor die that is responsive to external stimuli, such as light, sound, or temperature, to enhance the functionality and miniaturization of semiconductor devices.
Innovation Solution
A method involving the formation of a semiconductor device with an active surface containing a light-sensitive sensor, encapsulant, conductive layers, and a transmissive layer, along with solder bumps or interconnect structures to facilitate the response to external stimuli, while ensuring structural support and environmental isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor die includes a light-sensitive sensor on the active surface, then the device can respond to external stimuli, but the device complexity increases due to additional layers (encapsulant, transmissive layer, conductive layers)
Solution Approach 1:
The patent divides the semiconductor device into distinct functional layers: the active surface with light-sensitive sensor, the encapsulant layer, the transmissive layer, and conductive layers. Each layer performs a specific function, allowing the complex device to be managed through modular segmentation while maintaining responsiveness to external stimuli.
Solution Approach 2:
The patent implements a nested structure where the light-sensitive sensor is embedded within the active surface, which is then encapsulated by the encapsulant layer, followed by the transmissive layer and conductive layers. This nesting approach allows multiple functional elements to be integrated in a compact configuration, managing complexity through hierarchical organization.
2Volume of moving object
If the semiconductor die is made smaller to reduce footprint, then power consumption decreases and manufacturing efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent addresses miniaturization by extending the device structure into the vertical dimension with multiple layered components (encapsulant, transmissive layer, conductive layers) rather than increasing horizontal footprint. This dimensional transition allows compact size while distributing manufacturing precision requirements across multiple fabrication steps for each layer.
Solution Approach 2:
The patent applies preliminary encapsulation and layer formation during the manufacturing process to protect the light-sensitive sensor and establish precise structural relationships before final assembly. This preliminary action ensures that miniaturized features maintain required precision through built-in protection and pre-positioned layers.
3Reliability
If an encapsulant is deposited over the semiconductor die to provide environmental isolation, then reliability improves, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the encapsulation function with the structural support and environmental isolation requirements into a single integrated encapsulant layer. This layer simultaneously protects the light-sensitive sensor, provides mechanical support, and establishes the foundation for subsequent transmissive and conductive layers, reducing overall manufacturing complexity through functional consolidation.
Solution Approach 2:
The encapsulant layer serves multiple functions: environmental isolation for reliability, structural support for the overlying layers, and a base for forming the transmissive and conductive layers. This multi-functionality reduces the need for separate components, managing complexity while maintaining high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of smaller, more efficient semiconductor devices that can effectively respond to external stimuli, leading to improved performance and reduced costs through enhanced manufacturing processes.
Implementation Method 1
an active surface containing a light-sensitive sensor... The active surface responses to stimulus such as light
Data Source
AI summary
A semiconductor device has a first semiconductor die including an active region formed on a surface of the first semiconductor die. The active region of the first semiconductor die can include a sensor. An encapsulant is deposited over the first semiconductor die. A conductive layer is formed over the encapsulant and first semiconductor die. An insulating layer can be formed over the first semiconductor die. An opening is formed in the insulating layer over the active region. A transmissive layer is formed over the first semiconductor die including the active region. The transmissive layer includes an optical dielectric material or an optical transparent or translucent material. The active region is responsive to an external stimulus passing through the transmissive layer. A plurality of bumps is formed through the encapsulant and electrically connected to the conductive layer. A second semiconductor die is disposed adjacent to the first semiconductor die.