Semiconductor Transparent Member Shock-Absorbing Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face reliability issues due to thermal expansion differences between components, leading to stress and potential damage, particularly with the use of glass and sealing resins, which can result in peeling or breakage of the transparent member.
Innovation Solution
A semiconductor device design incorporating a transparent member separated from the semiconductor element by a designated distance, with a shock-absorbing member between the transparent member and the sealing resin to absorb thermal expansion stresses, and a manufacturing method involving the use of adhesive tape, piercing, and curing of shock-absorbing materials to ease stress and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass and sealing resin are used as transparent member and sealing material, then optical properties and sealing performance are improved, but thermal expansion stress causes peeling or breakage
Solution Approach 1:
A shock-absorbing member made of elastomer is introduced between the transparent member (glass) and the sealing resin to act as a stress-absorbing intermediary. This elastomer layer has a coefficient of thermal expansion between that of glass and sealing resin, and its elastic properties allow it to absorb thermal expansion stresses, preventing direct stress transmission that would cause glass breakage or interface peeling.
2Reliability
If ceramic board is used as wiring board to reduce thermal expansion, then thermal stress on transparent member is reduced, but device cost increases
Solution Approach 1:
Instead of replacing the wiring board material (which would increase cost), the invention uses a shock-absorbing elastomer member as an intermediary between the transparent member and the sealing resin. This approach maintains the cost-effective plastic wiring board while the elastomer absorbs the thermal expansion differences, achieving the same protective effect without the high cost of ceramic boards.
3Reliability
If same material is used for wiring board and transparent member to match thermal expansion, then thermal stress is reduced, but wiring board performance and cost are compromised
Solution Approach 1:
The shock-absorbing elastomer member serves as a mediator that allows different materials (plastic wiring board and glass transparent member) to be used without requiring them to have matching thermal expansion coefficients. The elastomer layer absorbs the thermal expansion mismatch, enabling versatile material selection for optimal electrical performance (wiring board) and optical performance (transparent member) without compromising thermal stress resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress and improves the reliability of semiconductor devices by preventing damage from thermal expansion, allowing for easier manufacturing without specialized apparatus and maintaining optical properties.
Implementation Method 1
a shock-absorbing member provided between an edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element
Implementation Method 2
coefficients of thermal expansion of members forming the solid-state image sensing device 10 are different from each other... the members may expand or contract by heat due to the difference of the coefficients of thermal expansion of the members
Data Source
AI summary
A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of the semiconductor element, and a shock-absorbing member provided between the edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element.